公开(公告)号：US09601286B2

公开(公告)日：2017-03-21

申请号：US14796223

申请日：2015-07-10

Applicant: Apple Inc.

Inventor： Stephen Brian Lynch ,  Pinida Jan Moolsintong ,  Leng Lim

IPC: H05K7/14 ,  H01H13/10 ,  H01H9/02 ,  H01H15/10 ,  H05K5/00 ,  H01H13/50 ,  H05K5/02

CPC classification number: H01H13/10 ,  H01H9/0207 ,  H01H13/50 ,  H01H15/10 ,  H01H2223/034 ,  H05K5/0013 ,  H05K5/0217 ,  H05K7/14 ,  Y10T29/49995

Abstract: Several mechanical features of an electronic device are provided. In some embodiments, the electronic device may include a bezel coupled to a housing. The bezel may include one or more snaps extending into the electronic device which may be operative to engage a cantilever spring extending from the inner surface of the housing. In some embodiments, the electronic device may include a window that is formed by coupling an outer layer to an inner layer that is larger than the outer layer. In some embodiments, the electronic device may include a chassis for supporting the window. In some embodiments, the electronic device may include a grounding clip for simultaneously grounding the bezel, the housing and a circuit board. In some embodiments, the electronic device may include a switch that includes a button molded into a base using a double shot process. In some embodiments, the electronic device may include a switch supporting bracket that includes a slot operative to receive a pin of the bezel. In some embodiments, the housing of the electronic device may be manufactured using a forging process.

公开(公告)号：US20150311011A1

公开(公告)日：2015-10-29

申请号：US14796223

申请日：2015-07-10

Applicant: Apple Inc.

Inventor： Stephen Brian Lynch ,  Pinida Jan Moolsintong ,  Leng Lim

IPC: H01H13/10 ,  H05K5/02 ,  H01H13/50 ,  H05K7/14

CPC classification number: H01H13/10 ,  H01H9/0207 ,  H01H13/50 ,  H01H15/10 ,  H01H2223/034 ,  H05K5/0013 ,  H05K5/0217 ,  H05K7/14 ,  Y10T29/49995

Abstract: Several mechanical features of an electronic device are provided. In some embodiments, the electronic device may include a bezel coupled to a housing. The bezel may include one or more snaps extending into the electronic device which may be operative to engage a cantilever spring extending from the inner surface of the housing. In some embodiments, the electronic device may include a window that is formed by coupling an outer layer to an inner layer that is larger than the outer layer. In some embodiments, the electronic device may include a chassis for supporting the window. In some embodiments, the electronic device may include a grounding clip for simultaneously grounding the bezel, the housing and a circuit board. In some embodiments, the electronic device may include a switch that includes a button molded into a base using a double shot process. In some embodiments, the electronic device may include a switch supporting bracket that includes a slot operative to receive a pin of the bezel. In some embodiments, the housing of the electronic device may be manufactured using a forging process.

Abstract translation: 提供了电子设备的几个机械特性。 在一些实施例中，电子设备可以包括联接到壳体的边框。 挡板可以包括延伸到电子设备中的一个或多个卡扣，其可操作以接合从壳体的内表面延伸的悬臂弹簧。 在一些实施例中，电子设备可以包括通过将外层耦合到比外层大的内层形成的窗口。 在一些实施例中，电子设备可以包括用于支撑窗口的底盘。 在一些实施例中，电子设备可以包括接地夹，用于同时接地边框，壳体和电路板。 在一些实施例中，电子设备可以包括开关，其包括使用双重注射工艺模制成基座的按钮。 在一些实施例中，电子设备可以包括开关支撑支架，该开关支撑支架包括可操作地接收所述边框的销的槽。 在一些实施例中，可以使用锻造工艺来制造电子设备的壳体。