公开(公告)号：US20240064464A1

公开(公告)日：2024-02-22

申请号：US17890249

申请日：2022-08-17

Applicant: Apple Inc.

Inventor： Marco BARATELLI ,  Dinesh BALAKRISHNAN ,  Logan A. ROTOLO ,  Pablo Seoane VIEITES ,  Matthew A. DONARSKI

IPC: H04R9/02 ,  H04R1/02

CPC classification number: H04R9/02 ,  H04R1/028 ,  H04R2499/15

Abstract: Implementations of the subject technology provide an acoustic module with a dampening component integrated within the acoustic module to reduce deflection of a wire for a voice coil. The dampening component can take the form of an adhesive or a semisolid. During operation of the audio module, the wire vibrates and deflects in an oscillating manner. However, the dampening component can reduce the magnitude of deflection, while allowing the audio module to function in a desired manner, i.e., generate acoustical energy. By reducing the magnitude of deflection, the dampening component reduces the likelihood of mechanical fatigue of the wire, thus reducing the likelihood of damage to the wire.