公开(公告)号：US20240073591A1

公开(公告)日：2024-02-29

申请号：US17895984

申请日：2022-08-25

Applicant: Apple Inc.

Inventor： Marco BARATELLI ,  Claudio NOTARANGELO ,  Matthew A. DONARSKI ,  Mo C. CHAN

IPC: H04R1/28

CPC classification number: H04R1/2888

Abstract: Implementations of the subject technology provide an acoustic module with fins integrated within the acoustic module to reduce acoustic noise. Airflow caused by pressure changes due to an oscillating diaphragm can be diverted by the fins within the acoustic module. The diverted airflow provide a more uniform airflow distribution within the acoustic module, which leads to a lower peak velocity and less unwanted noise. Fins may include a curved or crescent shape and may be spaced in a certain manner to divert the airflow.

公开(公告)号：US20160277819A1

公开(公告)日：2016-09-22

申请号：US15072312

申请日：2016-03-16

Applicant: Apple Inc.

Inventor： Michael D. McBROOM ,  Bartley K. ANDRE ,  Mikael M. SILVANTO ,  Matthew A. DONARSKI ,  Alexander V. SALVATTI ,  Daniel K. BOOTHE ,  Ryan J. MIHELICH ,  Sabrina K. PASEMAN

IPC: H04R1/02 ,  H04R1/28 ,  H04R9/06

CPC classification number: H04R9/06 ,  G06F1/16 ,  G06F1/20 ,  H04R1/02 ,  H04R1/34 ,  H04R9/02 ,  H04R2201/029 ,  H04R2209/022 ,  H04R2400/11 ,  H04R2499/15

Abstract: An electronic device including a frame member suitable for use with an audio driver is disclosed. The frame member may include a recessed region that receives the audio driver. The frame member may further include a flange member surrounding the recessed region. The frame member may be formed from a material having a relatively high coefficient of thermal conductivity. Accordingly, the frame member can dissipate thermal energy (heat) generated from the audio driver. In addition, the frame member may be seated in an enclosure of an electronic device in a manner that allows the frame member to pass the thermal energy to the enclosure. Also, the frame member may include a ferromagnetic material, which may cause the frame member to direct magnetic flux from a magnet of the audio driver in a desired manner.

Abstract translation: 公开了一种包括适合与音频驱动器一起使用的框架部件的电子设备。 框架构件可以包括接收音频驱动器的凹陷区域。 框架构件还可以包括围绕凹陷区域的凸缘构件。 框架构件可以由具有相对高的导热系数的材料形成。 因此，框架构件可以消散从音频驱动器产生的热能（热）。 此外，框架构件可以以允许框架构件将热能传递到外壳的方式坐在电子设备的外壳中。 此外，框架构件可以包括铁磁材料，其可以使框架构件以期望的方式引导来自音频驱动器的磁体的磁通量。

公开(公告)号：US20220322011A1

公开(公告)日：2022-10-06

申请号：US17220890

申请日：2021-04-01

Applicant: Apple Inc.

Inventor： Claudio NOTARANGELO ,  Onur ILKORUR ,  Matthew A. DONARSKI ,  Christopher WILK

IPC: H04R7/12 ,  H04R9/06

Abstract: Implementations of the subject technology provide vented audio transducers such as vented speakers. A speaker assembly may define a first volume under a dome of the speaker and a second volume under a surround of the speaker. The first volume and the second volume may be separated by a speaker structure such as a voice coil. By venting the first volume to the second volume, the disclosed vented speakers can provide a flatter response at high frequencies and lower distortion relative to conventional speakers, by equalizing the pressure under the diaphragm during operation.

公开(公告)号：US20240064464A1

公开(公告)日：2024-02-22

申请号：US17890249

申请日：2022-08-17

Applicant: Apple Inc.

Inventor： Marco BARATELLI ,  Dinesh BALAKRISHNAN ,  Logan A. ROTOLO ,  Pablo Seoane VIEITES ,  Matthew A. DONARSKI

IPC: H04R9/02 ,  H04R1/02

CPC classification number: H04R9/02 ,  H04R1/028 ,  H04R2499/15

Abstract: Implementations of the subject technology provide an acoustic module with a dampening component integrated within the acoustic module to reduce deflection of a wire for a voice coil. The dampening component can take the form of an adhesive or a semisolid. During operation of the audio module, the wire vibrates and deflects in an oscillating manner. However, the dampening component can reduce the magnitude of deflection, while allowing the audio module to function in a desired manner, i.e., generate acoustical energy. By reducing the magnitude of deflection, the dampening component reduces the likelihood of mechanical fatigue of the wire, thus reducing the likelihood of damage to the wire.

公开(公告)号：US20230379609A1

公开(公告)日：2023-11-23

申请号：US18144789

申请日：2023-05-08

Applicant: Apple Inc.

Inventor： Scott C. GRINKER ,  Ali N. ERGUN ,  Anthony D. MINERVINI ,  Claudio NOTARANGELO ,  Matthew A. DONARSKI

IPC: H04R1/04 ,  H04R1/08 ,  H04R1/02

CPC classification number: H04R1/04 ,  H04R1/083 ,  H04R1/025 ,  H04R2499/11 ,  H04R2400/11

Abstract: Implementations of the subject technology provide for a microphone in the front volume of a speaker. The speaker and the microphone may be provided in a single speaker assembly. The microphone may be implemented as an error microphone or a feedback microphone. The microphone may be mounted to a speaker frame of the speaker, with a sound-sensitive element of the microphone in the front volume of the speaker on a first side of the speaker frame, and with conductive contacts for the microphone disposed on an opposing second side of the speaker frame.