-
公开(公告)号：US20160150131A1
公开(公告)日：2016-05-26
申请号：US14550590
申请日：2014-11-21
Applicant: Apple Inc.
Inventor： Howell John Chua Toc , Prakash Venkatesappa , Annabelle Q. Yang , Melvin C. Cabonegro
CPC classification number: H04N5/2254 , G03B17/00 , G03B29/00 , H04M1/0264 , H04N5/2253
Abstract: An image sensor device includes a substrate, a die, and an adhesive layer positioned between the substrate and the die. The substrate includes a first side having a curved surface. The die includes an image sensor component attached to the curved surface of the substrate. At least a portion of the die comprising the image sensor component has a curved surface. The adhesive layer positioned between the curved surface of the substrate and the die provides a fixed attachment between the die and the substrate.
Abstract translation: 图像传感器装置包括基板，模具和位于基板和模具之间的粘合剂层。 基板包括具有弯曲表面的第一侧。 模具包括附着到基板的弯曲表面的图像传感器部件。 包括图像传感器部件的管芯的至少一部分具有弯曲表面。 位于基板的弯曲表面和模具之间的粘合剂层提供了在模具和基板之间的固定附着。
-
公开(公告)号：US11128786B2
公开(公告)日：2021-09-21
申请号：US14550590
申请日：2014-11-21
Applicant: Apple Inc.
Inventor： Howell John Chua Toc , Prakash Venkatesappa , Annabelle Q. Yang , Melvin C. Cabonegro
Abstract: An image sensor device includes a substrate, a die, and an adhesive layer positioned between the substrate and the die. The substrate includes a first side having a curved surface. The die includes an image sensor component attached to the curved surface of the substrate. At least a portion of the die comprising the image sensor component has a curved surface. The adhesive layer positioned between the curved surface of the substrate and the die provides a fixed attachment between the die and the substrate.
-
Search Results
2
records
(took 0.012 seconds)
