公开(公告)号：US20160150131A1

公开(公告)日：2016-05-26

申请号：US14550590

申请日：2014-11-21

Applicant: Apple Inc.

Inventor： Howell John Chua Toc ,  Prakash Venkatesappa ,  Annabelle Q. Yang ,  Melvin C. Cabonegro

IPC: H04N5/225 ,  B29C65/00

CPC classification number: H04N5/2254 ,  G03B17/00 ,  G03B29/00 ,  H04M1/0264 ,  H04N5/2253

Abstract: An image sensor device includes a substrate, a die, and an adhesive layer positioned between the substrate and the die. The substrate includes a first side having a curved surface. The die includes an image sensor component attached to the curved surface of the substrate. At least a portion of the die comprising the image sensor component has a curved surface. The adhesive layer positioned between the curved surface of the substrate and the die provides a fixed attachment between the die and the substrate.

Abstract translation: 图像传感器装置包括基板，模具和位于基板和模具之间的粘合剂层。 基板包括具有弯曲表面的第一侧。 模具包括附着到基板的弯曲表面的图像传感器部件。 包括图像传感器部件的管芯的至少一部分具有弯曲表面。 位于基板的弯曲表面和模具之间的粘合剂层提供了在模具和基板之间的固定附着。

公开(公告)号：US11671686B1

公开(公告)日：2023-06-06

申请号：US17025966

申请日：2020-09-18

Applicant: Apple Inc.

Inventor： Jay C. Maghirang ,  Ng Chin Chuan ,  Howell John Chua Toc ,  Ariel B. Hontiveros

IPC: H04N23/54 ,  H04N23/68

CPC classification number: H04N23/54 ,  H04N23/687

Abstract: A camera module may be assembled from a base component formed of a horizontal surface and having a raised wall that extends vertically from the horizontal surface and a housing component having a vertical surface that affixes to, with adhesive, the raised wall of the base component. Assembly of the camera module may include dispensing adhesive along a top edge of the raised wall to partially overhang the edge and placing the housing component down onto the base component. During assembly, the adhesive that is distributed on the top surface of the raised wall can be sheared or otherwise distributed by the action of the a corresponding wall of the housing component moving to past the top surface and causes at least some of the adhesive to spread between opposing surfaces of respective vertical walls of the base component and the housing component of the camera. The adhesive is then cured.

公开(公告)号：US10447900B2

公开(公告)日：2019-10-15

申请号：US14820485

申请日：2015-08-06

Applicant: Apple Inc.

Inventor： Annabelle Q. Yang ,  Howell John Chua Toc ,  Prakash Venkatesappa ,  Kolan Ravi Kanth

IPC: H04N5/225 ,  H05K1/18

Abstract: A camera module includes an image sensor, a flexible printed circuit with a first side affixed to a first side of the image sensor, a plurality of metallic leads affixed to a second side of the image sensor, and a lens assembly for directing light to the image sensor articulated to the image sensor by one or more of an overmolding attached to the leads and the flexible printed circuit. The first side of the image sensor is a side opposite the second side of the image sensor. The leads provide connection between the image sensor and leads in the flexible printed circuit.

公开(公告)号：US09443819B2

公开(公告)日：2016-09-13

申请号：US14179779

申请日：2014-02-13

Applicant: Apple Inc.

Inventor： Gerard Anthony C. Afable ,  Howell John Chua Toc ,  Prakash Venkatesappa ,  Kok Peng Teo ,  Annabelle Q. Yang

IPC: H01L23/00 ,  H01L27/146

CPC classification number: H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/95 ,  H01L27/14618 ,  H01L2224/73204 ,  H01L2224/75343 ,  H01L2224/75704 ,  H01L2224/7598 ,  H01L2224/81206 ,  H01L2224/83104 ,  H01L2224/95 ,  H01L2924/15153 ,  Y10T29/49826 ,  Y10T29/49998 ,  H01L2224/81 ,  H01L2924/00014

Abstract: A method and clamping apparatus for securing a substrate within a substrate carrier during an ultrasonic mounting process. The clamping apparatus may include a substrate carrier having a top plate and a bottom plate, the top plate and the bottom plate forming a cavity dimensioned to hold a substrate. A clamping plate is positioned on a side of the top plate opposite the bottom plate, the clamping plate having an opening aligned with the cavity and a pair of clamping members, each of the pair of clamping members extending toward a center of the opening and through the cavity such that the clamping member presses portions of the substrate exposed through the opening against the bottom plate. The method may include providing a clamping plate having an opening configured for alignment with a cavity formed in a substrate carrier and mounting a pair of resilient arms to the clamping plate.

Abstract translation: 一种用于在超声波安装过程中将衬底固定在衬底载体内的方法和夹紧装置。 夹紧装置可以包括具有顶板和底板的基板载体，顶板和底板形成尺寸适于保持基板的空腔。 夹板位于与底板相对的顶板的一侧上，夹板具有与空腔对准的开口和一对夹紧构件，每对夹紧构件中的每一个夹紧构件朝向开口的中心延伸并且通过 所述空腔使得所述夹紧构件将通过所述开口暴露的所述基板的部分压靠在所述底板上。 该方法可以包括提供具有开口的夹持板，所述开口被配置为与形成在基板载体中的空腔对准并将一对弹性臂安装到夹紧板。

公开(公告)号：US20250105228A1

公开(公告)日：2025-03-27

申请号：US18475054

申请日：2023-09-26

Applicant: Apple Inc.

Inventor： Kyusang Kim ,  David M Kindlon ,  Kishore N Renjan ,  Manoj Vadeentavida ,  Bilal Mohamed Ibrahim Kani ,  Benjamin J Grena ,  Ali N Ergun ,  Jerzy S Guterman ,  Jee Tung Tan ,  Steven Webster ,  Parin R Dedhia ,  Howell John Chua Toc ,  Mandar S Painaik ,  Abhay Maheshwari ,  Wyeman Chen ,  Yanfeng Chen ,  Andrew N Leopold ,  Jun Zhang ,  Dhruv Gaba

IPC: H01L25/16

Abstract: Packages and methods of assembly are described in which barriers are utilized during overmolding to improve volumetric efficiency. In one embodiment, a barrier includes multiple variable height components located on an interior of the barrier, where the barrier prevents the variable height components from being overmolded during the encapsulation process. In one embodiment, a barrier includes a camera module mounted on an image sensor located on an interior of the barrier, where the barrier prevents the camera module and image sensor from being overmolded during the encapsulation process. In an embodiment, a barrier is mounted on a secondary tier with the secondary tier mounted on a primary tier, where the barrier prevents multiple connector components located on an interior of the barrier from being overmolded during the encapsulation process.

公开(公告)号：US11128786B2

公开(公告)日：2021-09-21

申请号：US14550590

申请日：2014-11-21

Applicant: Apple Inc.

Inventor： Howell John Chua Toc ,  Prakash Venkatesappa ,  Annabelle Q. Yang ,  Melvin C. Cabonegro

IPC: H04N5/225 ,  G03B17/00 ,  G03B29/00 ,  H04M1/02

Abstract: An image sensor device includes a substrate, a die, and an adhesive layer positioned between the substrate and the die. The substrate includes a first side having a curved surface. The die includes an image sensor component attached to the curved surface of the substrate. At least a portion of the die comprising the image sensor component has a curved surface. The adhesive layer positioned between the curved surface of the substrate and the die provides a fixed attachment between the die and the substrate.

公开(公告)号：US20170041513A1

公开(公告)日：2017-02-09

申请号：US14820485

申请日：2015-08-06

Applicant: Apple Inc.

Inventor： Annabelle Q. Yang ,  Howell John Chua Toc ,  Prakash Venkatesappa ,  Kolan Ravi Kanth

IPC: H04N5/225

CPC classification number: H04N5/2252 ,  H04N5/2253 ,  H05K1/189 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/2009 ,  H05K2203/1316

Abstract: A camera module includes an image sensor, a flexible printed circuit with a first side affixed to a first side of the image sensor, a plurality of metallic leads affixed to a second side of the image sensor, and a lens assembly for directing light to the image sensor articulated to the image sensor by one or more of an overmoulding attached to the leads and the flexible printed circuit. The first side of the image sensor is a side opposite the second side of the image sensor. The leads provide connection between the image sensor and leads in the flexible printed circuit.

Abstract translation: 相机模块包括图像传感器，柔性印刷电路，其具有固定到图像传感器的第一侧的第一侧，固定到图像传感器的第二侧的多个金属引线，以及用于将光引导到 图像传感器通过连接到引线和柔性印刷电路的包覆成型中的一个或多个连接到图像传感器。 图像传感器的第一侧是与图像传感器的第二侧相对的一侧。 引线提供图像传感器和柔性印刷电路中的引线之间的连接。

公开(公告)号：US10171713B1

公开(公告)日：2019-01-01

申请号：US15275214

申请日：2016-09-23

Applicant: Apple Inc.

Inventor： Howell John Chua Toc ,  Iain A. McAllister ,  Steven Webster

IPC: B32B41/00 ,  H04N5/225

Abstract: A tracking code is applied to a lens housing that holds one more lenses. A back focus distance and a tilt of an optical axis with respect to a datum of the lens housing is electronically recorded. A position of an image sensor surface of an image sensor mounted on a substrate is measured. The lens housing is positioned such that the optical axis is perpendicular to the image sensor surface using the measured position of the image sensor surface and the electronically recorded optical data for the lens housing. The lens housing is positioned along the optical axis such that the lenses are separated from the image sensor surface using the measured position of the image sensor surface and the electronically recorded back focus distance for the tracking code of the lens housing. The lens housing is joined to the substrate with an adhesive.

公开(公告)号：US20150228529A1

公开(公告)日：2015-08-13

申请号：US14179779

申请日：2014-02-13

Applicant: Apple Inc.

Inventor： Gerard Anthony C. Afable ,  Howell John Chua Toc ,  Prakash Venkatesappa ,  Kok Peng Teo ,  Annabelle Q. Yang

IPC: H01L21/687 ,  H01L23/00

CPC classification number: H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/95 ,  H01L27/14618 ,  H01L2224/73204 ,  H01L2224/75343 ,  H01L2224/75704 ,  H01L2224/7598 ,  H01L2224/81206 ,  H01L2224/83104 ,  H01L2224/95 ,  H01L2924/15153 ,  Y10T29/49826 ,  Y10T29/49998 ,  H01L2224/81 ,  H01L2924/00014

Abstract: A method and clamping apparatus for securing a substrate within a substrate carrier during an ultrasonic mounting process. The clamping apparatus may include a substrate carrier having a top plate and a bottom plate, the top plate and the bottom plate forming a cavity dimensioned to hold a substrate. A clamping plate is positioned on a side of the top plate opposite the bottom plate, the clamping plate having an opening aligned with the cavity and a pair of clamping members, each of the pair of clamping members extending toward a center of the opening and through the cavity such that the clamping member presses portions of the substrate exposed through the opening against the bottom plate. The method may include providing a clamping plate having an opening configured for alignment with a cavity formed in a substrate carrier and mounting a pair of resilient arms to the clamping plate.

Abstract translation: 一种用于在超声波安装过程中将衬底固定在衬底载体内的方法和夹紧装置。 夹持装置可以包括具有顶板和底板的基板载体，顶板和底板形成尺寸适于保持基板的空腔。 夹板位于与底板相对的顶板的一侧上，夹板具有与空腔对准的开口和一对夹紧构件，每对夹紧构件中的每一个夹紧构件朝向开口的中心延伸并且通过 所述空腔使得所述夹紧构件将通过所述开口暴露的所述基板的部分压靠在所述底板上。 该方法可以包括提供具有开口的夹持板，所述开口被配置为与形成在基板载体中的空腔对准并将一对弹性臂安装到夹紧板。

公开(公告)号：US20150228517A1

公开(公告)日：2015-08-13

申请号：US14179777

申请日：2014-02-13

Applicant: Apple Inc.

Inventor： Howell John Chua Toc ,  Annabelle Q. Yang ,  Steven Webster

IPC: H01L21/673 ,  H01L21/683

CPC classification number: H01L21/67333 ,  Y10T29/49998

Abstract: A carrier apparatus and method of assembling a carrier apparatus for processing a substrate. The carrier including a first carrier plate having a first plurality of cavities, each of the first plurality of cavities dimensioned to receive a first side of a substrate. The carrier further including a second carrier plate having a second plurality of cavities, each of the second plurality of cavities dimensioned to receive a second side of the substrate when the first carrier plate and the second carrier plate are placed in contact with one another. A magnet assembly is further provided which is configured to hold the first carrier plate and the second carrier plate together, the magnet assembly having at least one magnet positioned within a recess formed along one side of the first carrier plate or the second carrier plate.

Abstract translation: 一种运载装置和组装用于处理基板的载体装置的方法。 所述载体包括具有第一多个空腔的第一载体板，所述第一多个空腔中的每一个的尺寸被设计成接收基板的第一侧。 载体还包括具有第二多个空腔的第二载体板，当第一载体板和第二载体板彼此接触放置时，第二多个空腔中的每一个的尺寸被设计成接收基板的第二侧。 还设置有磁体组件，其构造成将第一承载板和第二承载板保持在一起，磁体组件具有位于沿着第一承载板或第二承载板的一侧形成的凹部中的至少一个磁体。