公开(公告)号：US20240074066A1

公开(公告)日：2024-02-29

申请号：US18144031

申请日：2023-05-05

Applicant: Apple Inc.

Inventor： Nitesh KUMBHAT ,  Yanfeng Chen ,  Mandar S. Painaik ,  Shankar S. Pennathur ,  Pierpaolo Lupo

IPC: H05K3/28 ,  H01L21/56

CPC classification number: H05K3/284 ,  H01L21/565 ,  H05K2203/1316

Abstract: Various embodiments of a mold cavity structure of a transfer molding system are disclosed. The transfer molding system includes a first mold-forming structure and a second mold-forming structure. The second mold-forming structure includes a mold cavity. The mold cavity includes a gate region, a component region, and a vent region. The component region is configured to enclose an electrical component. A volume of the vent region is adjustable. The transfer molding system further includes an inlet port coupled to the gate region and configured to direct a flow of a molding compound into the mold cavity during an operation of the transfer molding system.