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公开(公告)号：US11817383B2
公开(公告)日：2023-11-14
申请号：US17685630
申请日：2022-03-03
Applicant: Apple Inc.
Inventor： Pierpaolo Lupo , Bilal Mohamed Ibrahim Kani , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida
IPC: H01L23/498 , G01K13/20 , G01K1/08 , G01K7/02 , G01K7/16 , H01L23/00 , H01L23/28 , H01L23/538
CPC classification number: H01L23/4985 , G01K1/08 , G01K7/02 , G01K7/16 , G01K13/20 , H01L23/00 , H01L23/28 , H01L23/538
Abstract: Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.
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公开(公告)号：US20240032203A1
公开(公告)日：2024-01-25
申请号：US18480303
申请日：2023-10-03
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Benjamin J. Grena , Kyusang Kim , David M. Kindlon , Pierpaolo Lupo , Kishore N. Renjan , Manoj Vadeentavida
CPC classification number: H05K1/186 , H05K1/189 , H05K1/0298 , H05K2201/10121 , H05K2201/10159 , H05K2201/10083 , H05K2201/10106 , H05K2201/10151 , H05K1/0274
Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.
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公开(公告)号：US11651976B2
公开(公告)日：2023-05-16
申请号：US16911153
申请日：2020-06-24
Applicant: Apple Inc.
Inventor： Kishore N. Renjan , Bilal Mohamed Ibrahim Kani , Kyusang Kim , Manoj Vadeentavida , Pierpaolo Lupo , Prashanth S. Holenarsipur , Praveesh Chandran , Vinodh Babu , Yuta Kuboyama
IPC: H01L21/56 , H01L23/31 , H01L23/498 , H01L23/538 , H01L23/00 , H01L25/065
CPC classification number: H01L21/565 , H01L21/561 , H01L21/568 , H01L23/3121 , H01L23/49811 , H01L23/49827 , H01L23/5383 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/97 , H01L25/0655 , H01L2224/02372 , H01L2224/02373 , H01L2224/04105 , H01L2224/12105 , H01L2224/13099 , H01L2224/48135
Abstract: Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.
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公开(公告)号：US20210181039A1
公开(公告)日：2021-06-17
申请号：US16711247
申请日：2019-12-11
Applicant: Apple Inc.
Inventor： Pierpaolo Lupo , Bilal Mohamed Ibrahim Kani , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida
Abstract: Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.
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公开(公告)号：US12028982B2
公开(公告)日：2024-07-02
申请号：US18480303
申请日：2023-10-03
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Benjamin J. Grena , Kyusang Kim , David M. Kindlon , Pierpaolo Lupo , Kishore N. Renjan , Manoj Vadeentavida
CPC classification number: H05K1/186 , H05K1/0298 , H05K1/189 , H05K1/0274 , H05K2201/10083 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151 , H05K2201/10159
Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.
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Patent Agency Ranking
公开(公告)号：US11864322B2
公开(公告)日：2024-01-02
申请号：US18164180
申请日：2023-02-03
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Benjamin J. Grena , Kyusang Kim , David M. Kindlon , Pierpaolo Lupo , Kishore N. Renjan , Manoj Vadeentavida
CPC classification number: H05K1/186 , H05K1/0298 , H05K1/189 , H05K1/0274 , H05K2201/10083 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151 , H05K2201/10159
Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.
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公开(公告)号：US11552053B2
公开(公告)日：2023-01-10
申请号：US16912000
申请日：2020-06-25
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida , Pierpaolo Lupo , Praveesh Chandran
Abstract: Optical sensor modules and methods of fabrication are described. In an embodiment, an optical component is mounted on a module substrate. In an embodiment, a pillar of stacked wireballs adjacent the optical component is used for vertical connection between the module substrate and a top electrode pad of the optical component.
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公开(公告)号：US11576262B2
公开(公告)日：2023-02-07
申请号：US17212983
申请日：2021-03-25
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Benjamin J. Grena , Kyusang Kim , David M. Kindlon , Pierpaolo Lupo , Kishore N. Renjan , Manoj Vadeentavida
Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.
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公开(公告)号：US11313741B2
公开(公告)日：2022-04-26
申请号：US16711247
申请日：2019-12-11
Applicant: Apple Inc.
Inventor： Pierpaolo Lupo , Bilal Mohamed Ibrahim Kani , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida
IPC: H01L23/538 , G01K13/20 , G01K1/08 , G01K7/02 , G01K7/16 , H01L23/00 , H01L23/28 , H01L23/498
Abstract: Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.
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公开(公告)号：US20210405313A1
公开(公告)日：2021-12-30
申请号：US16912000
申请日：2020-06-25
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida , Pierpaolo Lupo , Praveesh Chandran
Abstract: Optical sensor modules and methods of fabrication are described. In an embodiment, an optical component is mounted on a module substrate. In an embodiment, a pillar of stacked wireballs adjacent the optical component is used for vertical connection between the module substrate and a top electrode pad of the optical component.
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