公开(公告)号：US20180120893A1

公开(公告)日：2018-05-03

申请号：US15844162

申请日：2017-12-15

Applicant: Apple Inc.

Inventor： Lucy Elizabeth BROWNING ,  Benjamin J. POPE ,  Paul U. LEUTHEUSER ,  Scott A. MYERS ,  Richard Hung Minh DINH ,  Edward S. Huo

IPC: G06F1/16 ,  G06K9/00 ,  G06F3/16 ,  G06F3/01 ,  G06F3/044

CPC classification number: G06F1/169 ,  G06F1/1626 ,  G06F1/1671 ,  G06F1/1684 ,  G06F1/1688 ,  G06F3/016 ,  G06F3/044 ,  G06F3/165 ,  G06F3/167 ,  G06F2203/0338 ,  G06K9/0002 ,  H03K17/962 ,  H03K17/964 ,  H03K17/975

Abstract: Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.