COMBINATION VAPOR DEPOSITION CHAMBER
    1.
    发明申请
    COMBINATION VAPOR DEPOSITION CHAMBER 审中-公开
    组合蒸气沉积室

    公开(公告)号:US20150345007A1

    公开(公告)日:2015-12-03

    申请号:US14289453

    申请日:2014-05-28

    Applicant: Apple Inc.

    CPC classification number: C23C14/568 C23C14/0078 C23C14/505

    Abstract: This application relates to a combination vapor deposition process chamber. In, some embodiments, a combination vapor deposition process chamber can be used to apply an optical coating to a substrate such as glass, as well as an anti-smudge coating to the same substrate. The combination vapor deposition process chamber can include a sputter target, reactive gas and plasma source, and an anti-smudge coating source. Both sputter deposition and evaporation deposition can be performed with the combination vapor deposition process chamber without exposing the substrate to open air and contaminants between deposition processes. In some embodiments, the combination vapor deposition process chamber uses multiple sub-process chambers connected by a low pressure passageway for transferring substrates between deposition processes.

    Abstract translation: 本申请涉及一种组合气相沉积处理室。 在一些实施例中,可以使用组合气相沉积处理室将光学涂层施加到诸如玻璃的基底以及对同一基底的防污涂层。 组合气相沉积处理室可以包括溅射靶,反应气体和等离子体源以及防污涂层源。 可以使用组合气相沉积处理室进行溅射沉积和蒸发沉积,而不使基板暴露于沉积过程之间的空气和污染物。 在一些实施例中,组合气相沉积处理室使用由低压通道连接的多个子处理室,用于在沉积工艺之间传送基板。

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