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公开(公告)号:US20170082781A1
公开(公告)日:2017-03-23
申请号:US15275140
申请日:2016-09-23
Applicant: Apple Inc.
Inventor: Que Anh S. NGUYEN , Matthew S. ROGERS
CPC classification number: G02B1/115 , C03C17/3452 , G02B1/12 , G02B1/14
Abstract: Methods and systems for depositing a thin film are disclosed. The methods and systems can be used to deposit a film having a uniform thickness on a substrate surface that has a non-planar three-dimensional geometry, such as a curved surface. The methods involve the use of a deposition source that has a shape in accordance with the non-planar three-dimensional geometry of the substrate surface. In some embodiments, multiple layers of films are deposited onto each other forming multi-layered coatings. In some embodiments, the multi-layered coatings are antireflective (AR) coatings for windows or lenses.
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公开(公告)号:US20190256409A1
公开(公告)日:2019-08-22
申请号:US15976786
申请日:2018-05-10
Applicant: Apple Inc.
Inventor: James R. WILSON , Matthew S. ROGERS
Abstract: Components of an electronic device, such as glass components, are susceptible to surface damage. Glass components can be strengthened by providing ceramic particles at the exposed surface of the glass. Ceramic particles can also provide optical features, such as color, opacity, and haze to enhance the appearance of the resulting composite article. Where ceramic particles are provided at the exposed surface, the ceramic particles can also produce a desired tactile feature. These features can be provided in various combinations and in different ways across different regions to produce a desired look and feel of the resulting composite article.
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公开(公告)号:US20170267581A1
公开(公告)日:2017-09-21
申请号:US15448369
申请日:2017-03-02
Applicant: Apple Inc.
Inventor: Xianwei ZHAO , Avery P. YUEN , Lei YU , Li ZHANG , Wookyung BAE , Matthew S. ROGERS , Naoto MATSUYUKI , Sunggu KANG , Enkhamgalan DORJGOTOV , Cheng CHEN , John Z. ZHONG
CPC classification number: C03C17/42 , B32B9/04 , B32B17/06 , B32B2255/20 , B32B2255/26 , B32B2255/28 , B32B2307/412 , B32B2457/208 , C23C14/08 , C23C14/3414 , G06F3/041 , G06F2203/04103
Abstract: A bonding operation to increase the bond between a coating layer and substrate is described. The coating layer may be designed to resist residue on a substrate that covers a display of an electronic device. An adhesion layer including silica (SiO2) and a catalyst or dopant, such as zirconium, may be used to bond the coating layer with the substrate. The dopant can alter the chemical nature of the adhesion layer and increase the number of chemical bonding sites at a bonding surface of the adhesion layer, thereby creating an activated bonding surface. One activated surface of the adhesion layer can be bonded with the substrate, while another activated surface of the adhesion layer can be bonded with the coating layer.
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公开(公告)号:US20150345007A1
公开(公告)日:2015-12-03
申请号:US14289453
申请日:2014-05-28
Applicant: Apple Inc.
Inventor: Matthew S. ROGERS , Kristina A. BABIARZ , Rodrigo A. COFINO , Won B. BANG , Sunggu KANG , Rasmi R. DAS , Wookyung BAE , John Z. ZHONG
CPC classification number: C23C14/568 , C23C14/0078 , C23C14/505
Abstract: This application relates to a combination vapor deposition process chamber. In, some embodiments, a combination vapor deposition process chamber can be used to apply an optical coating to a substrate such as glass, as well as an anti-smudge coating to the same substrate. The combination vapor deposition process chamber can include a sputter target, reactive gas and plasma source, and an anti-smudge coating source. Both sputter deposition and evaporation deposition can be performed with the combination vapor deposition process chamber without exposing the substrate to open air and contaminants between deposition processes. In some embodiments, the combination vapor deposition process chamber uses multiple sub-process chambers connected by a low pressure passageway for transferring substrates between deposition processes.
Abstract translation: 本申请涉及一种组合气相沉积处理室。 在一些实施例中,可以使用组合气相沉积处理室将光学涂层施加到诸如玻璃的基底以及对同一基底的防污涂层。 组合气相沉积处理室可以包括溅射靶,反应气体和等离子体源以及防污涂层源。 可以使用组合气相沉积处理室进行溅射沉积和蒸发沉积,而不使基板暴露于沉积过程之间的空气和污染物。 在一些实施例中,组合气相沉积处理室使用由低压通道连接的多个子处理室,用于在沉积工艺之间传送基板。
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