Laser Processing of Fabric For Electronic Devices
    4.
    发明申请
    Laser Processing of Fabric For Electronic Devices 有权
    电子设备织物激光加工

    公开(公告)号:US20170069442A1

    公开(公告)日:2017-03-09

    申请号:US14844257

    申请日:2015-09-03

    Applicant: Apple Inc.

    Abstract: An electronic device such as a cover for a portable device or other electronic equipment may have circuitry mounted in a housing. The housing may be formed from layers of material such as fabric and polymer layers. The circuitry of the electronic device may include components mounted on a printed circuit. The components may include movable components such as keys in a keyboard. A fabric layer may overlap the keys. Border regions of the fabric layer that surround each key may be characterized by a stiffness. To ensure that the keys or other movable components in the device exhibit satisfactory stiffness levels, the keys can be tested and selected border regions or other fabric layer portions may be laser ablated or otherwise processed to locally reduce fabric layer stiffness.

    Abstract translation: 诸如用于便携式设备或其他电子设备的盖子的电子设备可以具有安装在壳体中的电路。 壳体可以由诸如织物和聚合物层的材料层形成。 电子设备的电路可以包括安装在印刷电路上的部件。 部件可以包括诸如键盘中的键的可移动部件。 织物层可能与钥匙重叠。 围绕每个键的织物层的边界区域可以由刚度来表征。 为了确保装置中的键或其他可移动部件具有令人满意的刚度水平,可以测试键,并且可以选择边界区域或其他织物层部分被激光烧蚀或以其它方式处理以局部地降低织物层刚度。

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