公开(公告)号：US10156874B2

公开(公告)日：2018-12-18

申请号：US15146825

申请日：2016-05-04

Applicant: Apple Inc.

Inventor： Lee E. Hooton ,  Ian A. Spraggs ,  Marwan Rammah ,  Seth Reightler ,  Tyler Kakuda

IPC: G09F13/04 ,  G06F1/20 ,  G06F1/16

Abstract: This application relates to thermal management of a computing device using various features that can dissipate and direct thermal energy. In some embodiments, a thermal insert is set forth for separating a component from a cover glass of the computing device. The thermal insert can be attached to a frame of the computing device by insert molding the thermal insert to the frame. In other embodiments, a graphite strip can be disposed across different surfaces within the computing device in order to direct thermal energy away from a component of the computing device. In yet other embodiments, a thermal spreader and thermally conductive adhesive can be disposed over different surfaces of the computing device. For example, the thermal spreader and thermally conductive adhesive can be used to direct thermal energy away from a backlight of the computing device.