公开(公告)号：US10991659B2

公开(公告)日：2021-04-27

申请号：US16704671

申请日：2019-12-05

Applicant: Apple Inc.

Inventor： Flynn P. Carson ,  Jun Chung Hsu ,  Meng Chi Lee ,  Shatki S. Chauhan

IPC: H01L23/552 ,  H01L21/78 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/28 ,  H01L23/00

Abstract: Packages including substrate-less integrated components and methods of fabrication are described are described. In an embodiment, a packaging method includes attaching a ground structure to a carrier and a plurality of components face down to the carrier and laterally adjacent to the ground structure. The plurality of components are encapsulated within a molding compound, and the carrier is removed exposing a plurality of component terminals and a plurality of ground structure terminals. A plurality of packages are singulated.