公开(公告)号：US20140262008A1

公开(公告)日：2014-09-18

申请号：US13888302

申请日：2013-05-06

Applicant: Apple Inc.

Inventor： Santhana Krishnan BALAJI ,  Sui-Lun WONG ,  Andrew D. LAUDER

IPC: B32B37/10 ,  B32B37/06

CPC classification number: B29C63/0004 ,  B29C63/0073 ,  B29C65/04 ,  B29C65/18 ,  B29C65/26 ,  B29C65/30 ,  B29C65/305 ,  B29C65/4815 ,  B29C65/4835 ,  B29C65/4855 ,  B29C66/1122 ,  B29C66/301 ,  B29C66/3472 ,  B29C66/5326 ,  B29C66/729 ,  B29C66/7294 ,  B29C66/81241 ,  B29C66/81422 ,  B29C66/81423 ,  B29C66/81431 ,  B29C66/81457 ,  B29C66/81459 ,  B29C66/8242 ,  B29C66/8244 ,  B29C66/8362 ,  B29C66/91423 ,  B29C66/919 ,  B29C66/9241 ,  B29C66/9261 ,  B29C66/934 ,  B29C66/93441 ,  B29C66/93451 ,  B29L2031/3481 ,  Y10T156/10

Abstract: A laminating device for bonding a protective layer to a substrate, including a driver and a roller head having a shape with a contour to fit a geometric feature of the substrate, is provided. The roller head has a cylindrical symmetry with an axis; the laminating device includes a coupler for mechanically coupling the driver to the roller head. The coupler is parallel to the axis so that the driver provides a rotational motion and a liner displacement to the roller head. The driver also provides a bonding energy to the roller head through the coupler. A roller head for use in a laminating device as above is also provided. A method for bonding a protective layer to a substrate using a laminating device as above is also provided.

Abstract translation: 提供了一种用于将保护层粘合到基底上的层压装置，包括具有轮廓的形状的驱动器和滚子头，以适应基片的几何特征。 辊头具有轴的圆柱对称性; 层压装置包括用于将驱动器机械地联接到辊头的联接器。 耦合器平行于轴线，使得驱动器向辊头提供旋转运动和衬套移动。 驱动器还通过耦合器为滚子头提供粘结能。 还提供了如上所述的用于层压装置的辊头。 还提供了使用如上所述的层压装置将保护层与基板接合的方法。