公开(公告)号：US09497529B2

公开(公告)日：2016-11-15

申请号：US14183306

申请日：2014-02-18

Applicant: Apple Inc.

Inventor： Peter N. Jeziorek ,  Justin D. Crosby ,  Trang Thi-Thanh Nguyen ,  Michelle R. Goldberg

IPC: H04R1/02 ,  H04R1/08 ,  H04R19/00 ,  H04R19/04

CPC classification number: H04R1/086 ,  H04R19/005 ,  H04R19/04 ,  H04R2499/11

Abstract: An electronic device may be provided with a microphone in a microphone port. A shield may cover a microelectromechanical systems microphone device on a microphone substrate. An opening in the microphone substrate may form a sound port for the microphone. The microphone port may be formed by perforations in the microphone substrate or other layers such as a flexible printed circuit layer, a sheet metal layer, a layer of adhesive, a flexible polymer carrier layer in an adhesive tape, or an electronic device housing. The perforations may be sufficiently small to help resist the intrusions of foreign material such as liquid and dirt into the sound port of the microphone. Larger openings may be formed in other structures such as an electronic device housing. The larger openings may serve as sound passageways for the microphone port while being sufficiently large to resist clogging.

Abstract translation: 电子设备可以在麦克风端口中设置有麦克风。 屏蔽可覆盖麦克风基板上的微机电系统麦克风装置。 麦克风基板上的开口可以形成麦克风的声音端口。 麦克风端口可以由麦克风基板或其它层中的穿孔形成，例如柔性印刷电路层，金属薄片层，粘合剂层，胶带中的柔性聚合物载体层或电子设备外壳。 穿孔可以足够小以帮助抵抗诸如液体和污物的异物侵入到麦克风的声音口中。 可以在诸如电子设备外壳的其它结构中形成更大的开口。 较大的开口可以用作麦克风端口的声音通道，同时足够大以抵抗堵塞。

公开(公告)号：US20150237431A1

公开(公告)日：2015-08-20

申请号：US14183306

申请日：2014-02-18

Applicant: Apple Inc.

Inventor： Peter N. Jeziorek ,  Justin D. Crosby ,  Trang Thi-Thanh Nguyen ,  Michelle R. Goldberg

IPC: H04R1/04

CPC classification number: H04R1/086 ,  H04R19/005 ,  H04R19/04 ,  H04R2499/11

Abstract: An electronic device may be provided with a microphone in a microphone port. A shield may cover a microelectromechanical systems microphone device on a microphone substrate. An opening in the microphone substrate may form a sound port for the microphone. The microphone port may be formed by perforations in the microphone substrate or other layers such as a flexible printed circuit layer, a sheet metal layer, a layer of adhesive, a flexible polymer carrier layer in an adhesive tape, or an electronic device housing. The perforations may be sufficiently small to help resist the intrusions of foreign material such as liquid and dirt into the sound port of the microphone. Larger openings may be formed in other structures such as an electronic device housing. The larger openings may serve as sound passageways for the microphone port while being sufficiently large to resist clogging.

Abstract translation: 电子设备可以在麦克风端口中设置有麦克风。 屏蔽可覆盖麦克风基板上的微机电系统麦克风装置。 麦克风基板上的开口可以形成麦克风的声音端口。 麦克风端口可以由麦克风基板或其它层中的穿孔形成，例如柔性印刷电路层，金属薄片层，粘合剂层，胶带中的柔性聚合物载体层或电子设备外壳。 穿孔可以足够小以帮助抵抗诸如液体和污物的异物侵入到麦克风的声音口中。 可以在诸如电子设备外壳的其它结构中形成更大的开口。 较大的开口可以用作麦克风端口的声音通道，同时足够大以抵抗堵塞。