Electronic Devices With Molded Polymer Structures

    公开(公告)号:US20220312607A1

    公开(公告)日:2022-09-29

    申请号:US17701516

    申请日:2022-03-22

    申请人: Apple Inc.

    IPC分类号: H05K5/02 H05K5/00 G02B6/42

    摘要: An electronic device may have a display mounted in a housing. The display may have a display panel with an array of pixels on a flexible substrate. A display cover layer may overlap the display panel. The flexible substrate may have a protruding portion that forms a tail. When the display is mounted in the housing, the tail may be bent back on itself to create a bend. The bend may be embedded in molded polymer. The device may have structures that help prevent the display cover layer from being compressed inwardly towards the rear of the housing such as frame structures embedded in the molded polymer and/or housing sidewall structures. Optical components and optical waveguides may be embedded within the molded polymer. Mating chamfers on the display cover layer and housing may help seat the display cover layer in the housing.