公开(公告)号：US20200332400A1

公开(公告)日：2020-10-22

申请号：US16533374

申请日：2019-08-06

Applicant: Apple Inc.

Inventor： Zechariah D. Feinberg ,  Abhijeet Misra ,  Lei Gao ,  Matthew D. Walker ,  Logan Ames ,  Duy P. Le ,  Vince Yan

IPC: C22C38/16 ,  B23K26/21 ,  B23K26/06

Abstract: An electronic device can include a component including a first material joined to a component including a second, different material. The first material can include steel and copper, while the second material can include aluminum. The first material can be joined to the second material by a pulsed laser welding process that forms an interface region having a ratio of an interface region length to a lateral length greater than about 1.4.