公开(公告)号：US20250048576A1

公开(公告)日：2025-02-06

申请号：US18915613

申请日：2024-10-15

Applicant: Apple Inc.

Inventor： Abhijeet Misra ,  Hoishun Li ,  Todd S. Mintz ,  Isabel Yang ,  James A. Curran ,  Lei Gao ,  Chuan Liu ,  Yu Yan

IPC: H05K5/04 ,  G06F1/16 ,  H05K5/00

Abstract: A housing for an electronic device can include an exterior titanium portion, an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion, and an intermetallic compound having a thickness of less than 1 μm disposed between the interior metal and the exterior titanium portion.

公开(公告)号：US20240373575A1

公开(公告)日：2024-11-07

申请号：US18651139

申请日：2024-04-30

Applicant: Apple Inc.

Inventor： Abhijeet Misra ,  Hoishun Li ,  Todd S. Mintz ,  Isabel Yang ,  James A. Curran ,  Lei Gao ,  Chuan Liu ,  Yu Yan

IPC: H05K5/04 ,  H05K5/00

Abstract: A housing for an electronic device can include an exterior titanium portion, an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion, and an intermetallic compound having a thickness of less than 1 μm disposed between the interior metal and the exterior titanium portion.

公开(公告)号：US12114453B2

公开(公告)日：2024-10-08

申请号：US16449061

申请日：2019-06-21

Applicant: Apple Inc.

Inventor： William A. Counts ,  Andrew W. Meschke ,  Lei Gao ,  Abhijeet Misra ,  Alexander W. Williams ,  Hoishun Li ,  Lee E. Hooton ,  Michael B. Wittenberg ,  James A. Yurko

IPC: H05K5/04 ,  A45C11/00 ,  G06F1/16 ,  H04M1/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03

CPC classification number: H05K5/04 ,  A45C11/00 ,  G06F1/1626 ,  H04M1/0283 ,  H05K5/0004 ,  H05K5/0213 ,  H05K5/03 ,  A45C2011/002 ,  G06F2200/1633

Abstract: A composite housing of an electronic device can include a metal shell including a first material having a first set of material properties and a surface at least partially defining an exterior surface of the electronic device. The composite housing can also include an interior portion including a second material having a second set of material properties independent of the first set of material properties and at least partially defining a feature. The interior portion can be bonded to the shell and disposed interior to the surface of the shell.

公开(公告)号：US20240284624A1

公开(公告)日：2024-08-22

申请号：US18650720

申请日：2024-04-30

Applicant: Apple Inc.

Inventor： William A. Counts ,  Andrew W. Meschke ,  Lei Gao ,  Abhijeet Misra ,  Alexander W. Williams ,  Hoishun Li ,  Lee E. Hooton ,  Michael B. Wittenberg ,  James A. Yurko

IPC: H05K5/04 ,  A45C11/00 ,  G06F1/16 ,  H04M1/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03

CPC classification number: H05K5/04 ,  A45C11/00 ,  G06F1/1626 ,  H04M1/0283 ,  H05K5/0004 ,  H05K5/0213 ,  H05K5/03 ,  A45C2011/002 ,  G06F2200/1633

Abstract: A composite housing of an electronic device can include a metal shell including a first material having a first set of material properties and a surface at least partially defining an exterior surface of the electronic device. The composite housing can also include an interior portion including a second material having a second set of material properties independent of the first set of material properties and at least partially defining a feature. The interior portion can be bonded to the shell and disposed interior to the surface of the shell.

公开(公告)号：US20200332400A1

公开(公告)日：2020-10-22

申请号：US16533374

申请日：2019-08-06

Applicant: Apple Inc.

Inventor： Zechariah D. Feinberg ,  Abhijeet Misra ,  Lei Gao ,  Matthew D. Walker ,  Logan Ames ,  Duy P. Le ,  Vince Yan

IPC: C22C38/16 ,  B23K26/21 ,  B23K26/06

Abstract: An electronic device can include a component including a first material joined to a component including a second, different material. The first material can include steel and copper, while the second material can include aluminum. The first material can be joined to the second material by a pulsed laser welding process that forms an interface region having a ratio of an interface region length to a lateral length greater than about 1.4.

公开(公告)号：US20200245487A1

公开(公告)日：2020-07-30

申请号：US16449061

申请日：2019-06-21

Applicant: Apple Inc.

Inventor： William A. Counts ,  Andrew W. Meschke ,  Lei Gao ,  Abhijeet Misra ,  Alexander W. Williams ,  Hoishun Li ,  Lee E. Hooton ,  Michael B. Wittenberg ,  James A. Yurko

IPC: H05K5/04 ,  H04M1/02 ,  G06F1/16 ,  A45C11/00 ,  H05K5/03 ,  H05K5/00 ,  H05K5/02

Abstract: A composite housing of an electronic device can include a metal shell including a first material having a first set of material properties and a surface at least partially defining an exterior surface of the electronic device. The composite housing can also include an interior portion including a second material having a second set of material properties independent of the first set of material properties and at least partially defining a feature. The interior portion can be bonded to the shell and disposed interior to the surface of the shell.

公开(公告)号：US12150264B1

公开(公告)日：2024-11-19

申请号：US18651139

申请日：2024-04-30

Applicant: Apple Inc.

Inventor： Abhijeet Misra ,  Hoishun Li ,  Todd S. Mintz ,  Isabel Yang ,  James A. Curran ,  Lei Gao ,  Chuan Liu ,  Yu Yan

IPC: G06F1/16 ,  H05K5/00 ,  H05K5/04

Abstract: A housing for an electronic device can include an exterior titanium portion, an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion, and an intermetallic compound having a thickness of less than 1 μm disposed between the interior metal and the exterior titanium portion.

公开(公告)号：US20240373574A1

公开(公告)日：2024-11-07

申请号：US18461458

申请日：2023-09-05

Applicant: Apple Inc.

Inventor： Abhijeet Misra ,  Hoishun Li ,  Todd S. Mintz ,  Isabel Yang ,  James A. Curran ,  Lei Gao ,  Chuan Liu ,  Yu Yan

IPC: H05K5/04 ,  H05K5/00

Abstract: A housing for an electronic device can include an exterior titanium portion, an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion, and an intermetallic compound having a thickness of less than 1 μm disposed between the interior metal and the exterior titanium portion.

公开(公告)号：US11207795B1

公开(公告)日：2021-12-28

申请号：US16137434

申请日：2018-09-20

Applicant: Apple Inc.

Inventor： Jeffrey L. Mattlin ,  Abhijeet Misra ,  Herng-Jeng Jou ,  James A. Wright ,  James A. Yurko ,  Lei Gao ,  Weiming Huang ,  William A. Counts

IPC: B28B7/36 ,  B29C43/32

Abstract: A mold apparatus to form a ceramic (or glass) includes a first mold portion having a first coefficient of thermal expansion and a second mold portion having a second coefficient of thermal expansion. In some embodiments, the first mold portion and/or the second mold portion are substantially immiscible with the ceramic material, such as silicon oxide, at a temperature greater than 600° C. In some embodiments, the first coefficient of thermal expansion and the second coefficient of thermal expansion are substantially similar to that of the glass or ceramic material. In some embodiments, the first coefficient of thermal expansion is different from the second coefficient of thermal expansion. In some embodiments, the first mold portion and the second mold portion contain a surface coating and a passivation layer.