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公开(公告)号：US20230102967A1
公开(公告)日：2023-03-30
申请号：US17850828
申请日：2022-06-27
Applicant: Apple Inc.
Inventor： Jeremy D. Witmer , Alfredo Bismuto , Jeffrey T. Hill , Junkyo Suh , Yigit O. Yilmaz
IPC: G02B6/42
Abstract: A photonic integrated circuit including multiple elements formed by different processes onto separate chips can be manufactured by defining, via photolithography processes for example, complementary geometries onto each separate chip. Thereafter, the complementary geometries can be aligned and engaged, thereby optically and mechanically intercoupling the several chips to define a single photonic integrated circuit.
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公开(公告)号：US12204155B2
公开(公告)日：2025-01-21
申请号：US17850828
申请日：2022-06-27
Applicant: Apple Inc.
Inventor： Jeremy D. Witmer , Alfredo Bismuto , Jeffrey T. Hill , Junkyo Suh , Yigit O. Yilmaz
IPC: G02B6/42
Abstract: A photonic integrated circuit including multiple elements formed by different processes onto separate chips can be manufactured by defining, via photolithography processes for example, complementary geometries onto each separate chip. Thereafter, the complementary geometries can be aligned and engaged, thereby optically and mechanically intercoupling the several chips to define a single photonic integrated circuit.
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