-
公开(公告)号：US12271042B2
公开(公告)日：2025-04-08
申请号：US18634911
申请日：2024-04-13
Applicant: Apple Inc.
Inventor： Alexander Goldis , Jeffrey T. Hill , Michael J. Bishop
Abstract: A photonics package may include a substrate, a hanging connector, and a fast-axis collimator (“FAC”). The hanging connector is typically affixed to a side of the substrate other than the side through which a light output is emitted. The hanging connector may be L-shaped in cross-section, having a base section and an extended section projecting from the base section. The base section affixes to the substrate while the extended section affixes to the FAC, so that the FAC extends downward along the emitter surface of the substrate; a vertex of the FAC is coplanar with an emitter outputting the light output.
-
公开(公告)号：US12204155B2
公开(公告)日：2025-01-21
申请号：US17850828
申请日：2022-06-27
Applicant: Apple Inc.
Inventor： Jeremy D. Witmer , Alfredo Bismuto , Jeffrey T. Hill , Junkyo Suh , Yigit O. Yilmaz
IPC: G02B6/42
Abstract: A photonic integrated circuit including multiple elements formed by different processes onto separate chips can be manufactured by defining, via photolithography processes for example, complementary geometries onto each separate chip. Thereafter, the complementary geometries can be aligned and engaged, thereby optically and mechanically intercoupling the several chips to define a single photonic integrated circuit.
-
公开(公告)号：US20240280767A1
公开(公告)日：2024-08-22
申请号：US18440193
申请日：2024-02-13
Applicant: Apple Inc.
Inventor： Jeremy D. Witmer , Jeffrey T. Hill , Yipin Wu , Zhechao Wang
IPC: G02B6/42
CPC classification number: G02B6/423
Abstract: An integrated photonic system including multiple photonic dies that are laterally aligned using contact between pairs of vertical surfaces. The vertical surfaces can be manufactured by defining, via photolithography processes for example, the shape of the vertical surfaces. Thereafter, the vertical surfaces can be aligned and engaged, thereby optically and mechanically intercoupling the multiple photonic dies.
-
公开(公告)号：US20240272380A1
公开(公告)日：2024-08-15
申请号：US18634911
申请日：2024-04-13
Applicant: Apple Inc.
Inventor： Alexander Goldis , Jeffrey T. Hill , Michael J. Bishop
CPC classification number: G02B6/4204 , G02B6/4206 , G02B6/4219 , G02B6/4244 , G02B6/4296 , G02B19/0057 , G02B6/30 , G02B6/4262
Abstract: A photonics package may include a substrate, a hanging connector, and a fast-axis collimator (“FAC”). The hanging connector is typically affixed to a side of the substrate other than the side through which a light output is emitted. The hanging connector may be L-shaped in cross-section, having a base section and an extended section projecting from the base section. The base section affixes to the substrate while the extended section affixes to the FAC, so that the FAC extends downward along the emitter surface of the substrate; a vertex of the FAC is coplanar with an emitter outputting the light output.
-
公开(公告)号：US20220128782A1
公开(公告)日：2022-04-28
申请号：US17508760
申请日：2021-10-22
Applicant: Apple Inc.
Inventor： Alexander Goldis , Jeffrey T. Hill , Michael J. Bishop
Abstract: A photonics package may include a substrate, a hanging connector, and a fast-axis collimator (“FAC”). The hanging connector is typically affixed to a side of the substrate other than the side through which a light output is emitted. The hanging connector may be L-shaped in cross-section, having a base section and an extended section projecting from the base section. The base section affixes to the substrate while the extended section affixes to the FAC, so that the FAC extends downward along the emitter surface of the substrate; a vertex of the FAC is coplanar with an emitter outputting the light output.
-
Patent Agency Ranking
公开(公告)号：US20250110043A1
公开(公告)日：2025-04-03
申请号：US18886953
申请日：2024-09-16
Applicant: Apple Inc.
Inventor： Mark A. Arbore , Alexander A. Miles , Matthew A. Terrel , Victoria Hwang , Samuel Steven , Trent D. Ridder , Jeffrey T. Hill , Sinclair A. Minshull
IPC: G01N21/31 , G01N33/483
Abstract: The disclosure relates to embodiments of optical measurement systems that are configured to perform spectroscopic measurements. The optical measurement systems are configured to provide compact arrangements for introducing light into a sample and collecting light returned from the sample. Reducing the size of the launch and/or collection architecture of an optical measurement system may make the overall optical measurement system smaller, thereby providing flexibility in integrating an optical measurement system into various form factors.
-
公开(公告)号：US11960128B2
公开(公告)日：2024-04-16
申请号：US17508760
申请日：2021-10-22
Applicant: Apple Inc.
Inventor： Alexander Goldis , Jeffrey T. Hill , Michael J. Bishop
CPC classification number: G02B6/4204 , G02B6/4206 , G02B6/4219 , G02B6/4244 , G02B6/4296 , G02B19/0057 , G02B6/30 , G02B6/4262
Abstract: A photonics package may include a substrate, a hanging connector, and a fast-axis collimator (“FAC”). The hanging connector is typically affixed to a side of the substrate other than the side through which a light output is emitted. The hanging connector may be L-shaped in cross-section, having a base section and an extended section projecting from the base section. The base section affixes to the substrate while the extended section affixes to the FAC, so that the FAC extends downward along the emitter surface of the substrate; a vertex of the FAC is coplanar with an emitter outputting the light output.
-
公开(公告)号：US12206222B2
公开(公告)日：2025-01-21
申请号：US17407016
申请日：2021-08-19
Applicant: Apple Inc.
Inventor： Jeffrey T. Hill , Alfredo Bismuto , Tomas Sarmiento
IPC: H01S5/00 , H01S5/026 , H01S5/042 , H01S5/12 , H01S5/185 , H01S5/187 , H01S5/42 , H01S5/028 , H01S5/183
Abstract: Configurations for an edge-generated vertical emission laser that vertically emits light and fabrication methods of the edge-generated vertical emission laser are disclosed. The edge-generated vertical emission laser may include a distributed feedback (DFB) laser structure, a grating coupler, and contact layers. Light may propagate through the DFB laser structure, approximately parallel to the top surface of the edge-generated vertical emission laser and be directed by the grating coupler toward the top surface of the edge-generated vertical emission laser. The light may vertically emit from the edge-generated vertical emission laser approximately perpendicular to the top surface of the edge-generated vertical emission laser. Additionally, the contact layers may be n-metal and p-metal, which may be located on the same side of the edge-generated vertical emission laser. These features of the edge-generated vertical emission laser may facilitate ease of testing and increased options for packaging.
-
公开(公告)号：US20230102967A1
公开(公告)日：2023-03-30
申请号：US17850828
申请日：2022-06-27
Applicant: Apple Inc.
Inventor： Jeremy D. Witmer , Alfredo Bismuto , Jeffrey T. Hill , Junkyo Suh , Yigit O. Yilmaz
IPC: G02B6/42
Abstract: A photonic integrated circuit including multiple elements formed by different processes onto separate chips can be manufactured by defining, via photolithography processes for example, complementary geometries onto each separate chip. Thereafter, the complementary geometries can be aligned and engaged, thereby optically and mechanically intercoupling the several chips to define a single photonic integrated circuit.
-
公开(公告)号：US20220059992A1
公开(公告)日：2022-02-24
申请号：US17407016
申请日：2021-08-19
Applicant: Apple Inc.
Inventor： Jeffrey T. Hill , Alfredo Bismuto , Tomas Sarmiento
Abstract: Configurations for an edge-generated vertical emission laser that vertically emits light and fabrication methods of the edge-generated vertical emission laser are disclosed. The edge-generated vertical emission laser may include a distributed feedback (DFB) laser structure, a grating coupler, and contact layers. Light may propagate through the DFB laser structure, approximately parallel to the top surface of the edge-generated vertical emission laser and be directed by the grating coupler toward the top surface of the edge-generated vertical emission laser. The light may vertically emit from the edge-generated vertical emission laser approximately perpendicular to the top surface of the edge-generated vertical emission laser. Additionally, the contact layers may be n-metal and p-metal, which may be located on the same side of the edge-generated vertical emission laser. These features of the edge-generated vertical emission laser may facilitate ease of testing and increased options for packaging.
-
-
-
-
-
-
-
-
-
Search Results
10
records
(took 0.024 seconds)
