公开(公告)号：US20250048576A1

公开(公告)日：2025-02-06

申请号：US18915613

申请日：2024-10-15

Applicant: Apple Inc.

Inventor： Abhijeet Misra ,  Hoishun Li ,  Todd S. Mintz ,  Isabel Yang ,  James A. Curran ,  Lei Gao ,  Chuan Liu ,  Yu Yan

IPC: H05K5/04 ,  G06F1/16 ,  H05K5/00

Abstract: A housing for an electronic device can include an exterior titanium portion, an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion, and an intermetallic compound having a thickness of less than 1 μm disposed between the interior metal and the exterior titanium portion.

公开(公告)号：US20240373575A1

公开(公告)日：2024-11-07

申请号：US18651139

申请日：2024-04-30

Applicant: Apple Inc.

Inventor： Abhijeet Misra ,  Hoishun Li ,  Todd S. Mintz ,  Isabel Yang ,  James A. Curran ,  Lei Gao ,  Chuan Liu ,  Yu Yan

IPC: H05K5/04 ,  H05K5/00

Abstract: A housing for an electronic device can include an exterior titanium portion, an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion, and an intermetallic compound having a thickness of less than 1 μm disposed between the interior metal and the exterior titanium portion.

公开(公告)号：US12150264B1

公开(公告)日：2024-11-19

申请号：US18651139

申请日：2024-04-30

Applicant: Apple Inc.

Inventor： Abhijeet Misra ,  Hoishun Li ,  Todd S. Mintz ,  Isabel Yang ,  James A. Curran ,  Lei Gao ,  Chuan Liu ,  Yu Yan

IPC: G06F1/16 ,  H05K5/00 ,  H05K5/04

Abstract: A housing for an electronic device can include an exterior titanium portion, an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion, and an intermetallic compound having a thickness of less than 1 μm disposed between the interior metal and the exterior titanium portion.

公开(公告)号：US20240373574A1

公开(公告)日：2024-11-07

申请号：US18461458

申请日：2023-09-05

Applicant: Apple Inc.

Inventor： Abhijeet Misra ,  Hoishun Li ,  Todd S. Mintz ,  Isabel Yang ,  James A. Curran ,  Lei Gao ,  Chuan Liu ,  Yu Yan

IPC: H05K5/04 ,  H05K5/00

Abstract: A housing for an electronic device can include an exterior titanium portion, an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion, and an intermetallic compound having a thickness of less than 1 μm disposed between the interior metal and the exterior titanium portion.