公开(公告)号：US20250118578A1

公开(公告)日：2025-04-10

申请号：US18484165

申请日：2023-10-10

Applicant: Applied Materials, Inc.

Inventor： Ajith Karonnan Ramapurath ,  Jian Li ,  Ganesh Balasubramanian ,  Juan Carlos Rocha-Alvarez

IPC: H01L21/67 ,  H01J37/32 ,  H01L21/66 ,  H01L21/683

Abstract: Exemplary substrate support assemblies may include a support plate that comprises a substrate support surface. The assemblies may include a support stem coupled with the support plate. A channel may be defined through at least a portion of a length of the support stem and extends through the substrate support surface. A temperature sensor assembly may be disposed within the channel. The temperature sensor assembly may include a light pipe disposed within the channel such that a top end of the light pipe extending through at least a portion of the support plate. The temperature sensor assembly may include a sensor that is coupled with a bottom end of the light pipe.