公开(公告)号：US20240249965A1

公开(公告)日：2024-07-25

申请号：US18099210

申请日：2023-01-19

Applicant: Applied Materials, Inc.

Inventor： Arvinder Manmohan Singh CHADHA ,  Jonathan SIMMONS ,  Stephen Donald PROUTY ,  Christopher BEAUDRY ,  Glen T. MORI ,  Anand DURAIRAJAN

IPC: H01L21/683 ,  H01L21/687

CPC classification number: H01L21/6833 ,  H01L21/68735 ,  H01L21/68757

Abstract: A substrate support carrier includes an electrostatic chuck (ESC) assembly includes a top ceramic disc having a recess formed from a lower surface of the top ceramic disc, a bottom ceramic disc having a hole through the bottom ceramic disc, an upper bonding layer interposed between the lower surface of the top ceramic disc and an upper surface of the bottom ceramic disc, and a porous plug within at least one of the recess of the top ceramic disc and the hole of the bottom ceramic disc, a temperature control base, and a lower bonding layer interposed between a lower surface of the bottom ceramic disc and an upper surface of the temperature control base.