公开(公告)号：US20240249965A1

公开(公告)日：2024-07-25

申请号：US18099210

申请日：2023-01-19

Applicant: Applied Materials, Inc.

Inventor： Arvinder Manmohan Singh CHADHA ,  Jonathan SIMMONS ,  Stephen Donald PROUTY ,  Christopher BEAUDRY ,  Glen T. MORI ,  Anand DURAIRAJAN

IPC: H01L21/683 ,  H01L21/687

CPC classification number: H01L21/6833 ,  H01L21/68735 ,  H01L21/68757

Abstract: A substrate support carrier includes an electrostatic chuck (ESC) assembly includes a top ceramic disc having a recess formed from a lower surface of the top ceramic disc, a bottom ceramic disc having a hole through the bottom ceramic disc, an upper bonding layer interposed between the lower surface of the top ceramic disc and an upper surface of the bottom ceramic disc, and a porous plug within at least one of the recess of the top ceramic disc and the hole of the bottom ceramic disc, a temperature control base, and a lower bonding layer interposed between a lower surface of the bottom ceramic disc and an upper surface of the temperature control base.

公开(公告)号：US20220172975A1

公开(公告)日：2022-06-02

申请号：US17672507

申请日：2022-02-15

Applicant: Applied Materials, Inc.

Inventor： Stephen Donald PROUTY ,  Andreas SCHMID ,  Jonathan SIMMONS ,  Sumanth BANDA

IPC: H01L21/683 ,  H01L21/673

Abstract: A substrate support pedestal comprises an electrostatic chuck, a cooling base, a gas flow passage, a porous plug, and a sealing member. The electrostatic chuck comprises body having a cavity. The cooling base is coupled to the electrostatic chuck via a bond layer. The gas flow passage is formed between a top surface of the electrostatic chuck and a bottom surface of the cooling base. The gas flow passage further comprises the cavity. The porous plug is positioned within the cavity to control the flow of gas through the gas flow passage. The sealing member is positioned in a groove formed in the cooling base and configured to form a seal between the cooling base and one or both of the porous plug and the body of the electrostatic chuck.

公开(公告)号：US20200373184A1

公开(公告)日：2020-11-26

申请号：US16857082

申请日：2020-04-23

Applicant: Applied Materials, Inc.

Inventor： Stephen Donald PROUTY ,  Andreas SCHMID ,  Jonathan SIMMONS ,  Sumanth BANDA

IPC: H01L21/683 ,  H01L21/673

Abstract: A substrate support pedestal comprises an electrostatic chuck, a cooling base, a gas flow passage, a porous plug, and a sealing member. The electrostatic chuck comprises body having a cavity. The cooling base is coupled to the electrostatic chuck via a bond layer. The gas flow passage is formed between a top surface of the electrostatic chuck and a bottom surface of the cooling base. The gas flow passage further comprises the cavity. The porous plug is positioned within the cavity to control the flow of gas through the gas flow passage. The sealing member is positioned adjacent to the porous plug and is configured to form one or more of a radial seal between the porous plug and the cavity and an axial seal between the porous plug and the cooling base.

公开(公告)号：US20250075795A1

公开(公告)日：2025-03-06

申请号：US18523111

申请日：2023-11-29

Applicant: Applied Materials, Inc.

Inventor： Jonathan SIMMONS ,  Andreas SCHMID ,  Sahiti NALLAGONDA

IPC: F16J15/06 ,  H01J37/32

Abstract: Disclosed herein is a seal assembly for a substrate processing chamber and a component assembly containing the seal assembly. The seal assembly includes a ring-shaped seal member; a holder disposed radially inward of the ring-shaped seal member; and a retaining mechanism coupling the ring-shaped seal member with the holder. The component assembly includes a first component coupled with a second component via a bonding layer; a groove formed by the first component, the second component, and the bonding layer; and the seal assembly disposed in the groove.

公开(公告)号：US20200027769A1

公开(公告)日：2020-01-23

申请号：US16037975

申请日：2018-07-17

Applicant: Applied Materials, Inc.

Inventor： Jonathan SIMMONS ,  Dana LOVELL

IPC: H01L21/683 ,  H01L21/67

Abstract: The present disclosure generally relates to an electrostatic chuck for processing substrates. The electrostatic chuck includes a facilities plate and an insulator disposed between a cooling base and a ground plate. A support body is coupled to the cooling base for supporting a substrate thereon. A ring is configured to surround the insulator. The ring is formed from a material that is resistant to degradation from exposure to a manufacturing process. The ring optionally includes an extension configured to surround the facilities plate.