公开(公告)号：US11806829B2

公开(公告)日：2023-11-07

申请号：US16906992

申请日：2020-06-19

Applicant: Applied Materials, Inc.

Inventor： Puneet Narendra Jawali ,  Nandan Baradanahalli Kenchappa ,  Jason G. Fung ,  Shiyan Akalanka Jayanath Wewala Gonnagahadeniyage ,  Rajeev Bajaj ,  Adam Wade Manzonie ,  Andrew Scott Lawing

IPC: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B24B37/30

CPC classification number: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B24B37/30

Abstract: Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pad includes a polishing layer. At least a portion of the polishing layer comprises a continuous phase of polishing material featuring a plurality of first regions having a first pore-feature density and a plurality of second regions having a second pore-feature density that is different from the first pore-feature density. The plurality of first regions are distributed in a pattern in an X-Y plane of the polishing pad in a side-by-side arrangement with the plurality of second regions and individual portions or ones of the plurality of first regions are interposed between individual portions or ones of the plurality of second regions.