公开(公告)号：US20040020788A1

公开(公告)日：2004-02-05

申请号：US10210972

申请日：2002-08-02

Applicant: Applied Materials, Inc.

Inventor： Rashid Mavliev ,  Stan Tsai ,  Yongqi Hu ,  Paul Butterfield ,  Antoine Manens ,  Liang-Yuh Chen

IPC: B23H003/04

CPC classification number: B23H5/08 ,  B24B37/046 ,  B24B37/20 ,  H01L21/32125

Abstract: Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact element is a rotating member. In one embodiment, the contact element comprises a noble metal.

公开(公告)号：US20040023495A1

公开(公告)日：2004-02-05

申请号：US10211626

申请日：2002-08-02

Applicant: Applied Materials, Inc.

Inventor： Paul Butterfield ,  Liang-Yuh Chen ,  Yongqi Hu ,  Antoine Manens ,  Rashid Mavliev ,  Stan Tsai

IPC: H01L021/302 ,  H01L021/461

CPC classification number: H01L21/32125 ,  B23H5/08 ,  B24B37/046 ,  B24B37/24 ,  B24B53/017

Abstract: Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact element is a rotating member. In one embodiment, the contact element comprises a noble metal.

Abstract translation: 电化学处理的系统和方法。 接触元件限定在处理期间可定位成接触衬底的衬底接触表面。 在一个实施例中，接触元件包括线元件。 在另一个实施例中，接触元件是旋转构件。 在一个实施例中，接触元件包括贵金属。