公开(公告)号：US20250117915A1

公开(公告)日：2025-04-10

申请号：US18482209

申请日：2023-10-06

Applicant: Applied Materials, Inc.

Inventor： Navneet Kumar Singh ,  Arun Ramaswamy Srivatsa ,  Sachin Dangayach ,  Zvi Hersh Goldshtein ,  Rahul Reddy Komatireddi ,  Sutapa Dutta ,  Arv Nagpal ,  Yen-Tien Wu

IPC: G06T7/00

Abstract: Implementations disclosed describe, among other things, a systems and techniques for perform efficient inspection of a semiconductor manufacturing sample. The techniques include collecting optical inspection data for training sample(s) that have a plurality of defects. The techniques further include generating, using the optical inspection data, a training data set that includes descriptions, images, and ground truth classifications for the defects. The techniques further include using the training data set to train a plurality of machine learning (ML) classifiers to generate predicted classifications for the defects in the training sample(s). The techniques further include selecting, using the predicted classifications and the ground truth classifications, one or more ML classifiers that meet one or more accuracy criteria, and using the selected ML classifier(s) to classify defects in the semiconductor manufacturing sample.