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公开(公告)号：US20220184771A1
公开(公告)日：2022-06-16
申请号：US17121467
申请日：2020-12-14
Applicant: Applied Materials, Inc.
Inventor： Asheesh JAIN , Sameer DESHPANDE
Abstract: Embodiments herein include carrier loading stations and methods related thereto which may be used to beneficially remove nano-scale and/or micron-scale particles adhered to a bevel edge of a substrate before polishing of the substrate. By removing such contaminates, e.g., loosely adhered particles of dielectric material, from the bevel edge, contamination of the polishing interface can be avoided thus preventing and/or substantially reducing scratch related defectivity associated therewith.
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