公开(公告)号：US20200055161A1

公开(公告)日：2020-02-20

申请号：US16661400

申请日：2019-10-23

Applicant: Applied Materials, Inc.

Inventor： Ashwin CHOCKALINGHAM ,  Mahendra C. ORILALL ,  Mayu YAMAMURA ,  Boyi FU ,  Rajeev BAJAJ ,  Daniel REDFIELD

IPC: B24B37/20 ,  B24B37/26 ,  B24B37/24 ,  H01L21/306

Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.