公开(公告)号：US10399205B2

公开(公告)日：2019-09-03

申请号：US15426039

申请日：2017-02-06

Applicant: Applied Materials, Inc.

Inventor： Balasubramaniam C. Jaganathan ,  Rajeev Bajaj

IPC: B24B57/02 ,  B24B37/20

Abstract: Embodiments of the present invention provide systems, apparatus, and methods for chemical polishing a substrate using a fluid network platen assembly that includes a pad having a plurality of fluid openings; a network of a plurality of fluid channels, each channel in fluid communication with at least one fluid opening; a plurality of inlets, each inlet coupled to a different fluid channel; and an outlet coupled to one of the fluid channels not coupled to an inlet. Numerous additional aspects are disclosed.

公开(公告)号：US20170225294A1

公开(公告)日：2017-08-10

申请号：US15426039

申请日：2017-02-06

Applicant: Applied Materials, Inc.

Inventor： Balasubramaniam C. Jaganathan ,  Rajeev Bajaj

IPC: B24B57/02 ,  B24B37/20

CPC classification number: B24B57/02 ,  B24B37/20

Abstract: Embodiments of the present invention provide systems, apparatus, and methods for chemical polishing a substrate using a fluid network platen assembly that includes a pad having a plurality of fluid openings; a network of a plurality of fluid channels, each channel in fluid communication with at least one fluid opening; a plurality of inlets, each inlet coupled to a different fluid channel; and an outlet coupled to one of the fluid channels not coupled to an inlet. Numerous additional aspects are disclosed.