公开(公告)号：US20240290638A1

公开(公告)日：2024-08-29

申请号：US18174534

申请日：2023-02-24

申请人： Applied Materials, Inc.

发明人： Dmitry Lubomirsky ,  Kaushik Alayavalli ,  Amit Ashok Hattangadi ,  Bhawesh Agrawal ,  Vishwas Basavarajaiah Somashekar ,  Chethan Somanahalli Malleshappa

IPC分类号： H01L21/67 ,  H01L21/687

CPC分类号： H01L21/6719 ,  H01L21/67173 ,  H01L21/68742

摘要： Exemplary semiconductor processing systems may include a chamber having a body having a sidewall and a base. The chamber may include a pumping liner atop the body and a faceplate atop the pumping liner. The chamber may include a substrate support. The substrate support may include a plate and a shaft. The chamber may include a seal plate coupled with the shaft below the plate. The seal plate may have a greater diameter than the plate. The seal plate may include an RF gasket outward of the plate. The substrate support and the seal plate may be translatable between a transfer position in which the RF gasket is vertically spaced apart from the pumping liner and a process position in which the RF gasket is in contact with the pumping liner. A processing region may be isolated from an environment below the sealing plate when in the process position.