公开(公告)号：US20220072682A1

公开(公告)日：2022-03-10

申请号：US17407062

申请日：2021-08-19

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon OH ,  Manoj A. Gajendra ,  John Anthony Garcia ,  Chetan Kumar Mylappanahalli Narasingaiah ,  Sanjay Bhanrao Chavan ,  Gagan Dobhal ,  Manoj Balakumar ,  Jamie Stuart Leighton ,  Van H. Nguyen

IPC: B24B57/02 ,  B24B37/10 ,  B24B37/04 ,  B24B37/30 ,  B24B37/34 ,  H01L21/02

Abstract: A system and method for sequential single-sided CMP processing of opposite facing surfaces of a silicon carbide (SiC) substrate are disclosed. A method includes urging a first surface of a substrate against one of plurality of polishing pads, wherein the plurality of polishing pads are disposed on corresponding ones of a plurality of rotatable polishing platens. The method includes transferring, using the first side of the end effector, the substrate from the substrate carrier loading station to a substrate alignment station. The method includes transferring, using the first side of the end effector, the substrate from the substrate alignment station to a substrate carrier loading station. The method includes urging a second surface of the substrate against one of the plurality of polishing platens.