公开(公告)号：US20200333711A1

公开(公告)日：2020-10-22

申请号：US16917278

申请日：2020-06-30

Applicant: Applied Materials, Inc.

Inventor： Ching-Chang CHEN ,  Chien-Hua LAI ,  Wei-Chung CHEN ,  Shih-Hao KUO ,  Hsiu-Jen WANG

IPC: G03F7/20

Abstract: Embodiments described provide dynamic imaging systems that compensates for pattern defects resulting from distortion caused by warpage of the substrate. The methods and apparatus described are useful to create compensated exposure patterns. The dynamic imaging system includes an inspection system configured to provide 3D profile measurements and die shift measurements of the first substrate to the interface configured to provide compensated pattern data to the digital lithography system configured to receive the compensated pattern data from the interface and expose the photoresist with a compensated pattern.

公开(公告)号：US20200019065A1

公开(公告)日：2020-01-16

申请号：US16031675

申请日：2018-07-10

Applicant: Applied Materials, Inc.

Inventor： Ching-Chang CHEN ,  Chien-Hua LAI ,  Wei-Chung CHEN ,  Shih-Hao KUO ,  Hsiu-Jen WANG

IPC: G03F7/20

Abstract: Embodiments described provide dynamic imaging systems that compensates for pattern defects resulting from distortion caused by warpage of the substrate. The methods and apparatus described are useful to create compensated exposure patterns. The dynamic imaging system includes an inspection system configured to provide 3D profile measurements and die shift measurements of the first substrate to the interface configured to provide compensated pattern data to the digital lithography system configured to receive the compensated pattern data from the interface and expose the photoresist with a compensated pattern.