公开(公告)号：US20240231239A9

公开(公告)日：2024-07-11

申请号：US18048748

申请日：2022-10-21

Applicant: Applied Materials, Inc.

Inventor： YingChiao WANG ,  Chi-Ming TSAI ,  Chun-chih CHUANG ,  Yung Peng HU

IPC: G03F7/20 ,  G02B26/08

CPC classification number: G03F7/70191 ,  G02B26/0833

Abstract: Embodiments of the present disclosure generally relate to lithography systems. More particularly, embodiments of the present disclosure relate to a method, a system, and a software application for a lithography process to control transmittance rate of write beams and write gray tone patterns in a single exposure operation. In one embodiment, a plurality of shots are provided by an image projection system in a lithography system to a photoresist layer. The plurality of shots exposes the photoresist layer to an intensity of light emitted from the image projection system. The local transmittance rate of the plurality of shots within an exposure area is varied to form varying step heights in the exposure area of the photoresist layer.

公开(公告)号：US20250068082A1

公开(公告)日：2025-02-27

申请号：US18942941

申请日：2024-11-11

Applicant: Applied Materials, Inc.

Inventor： YingChiao WANG ,  Chi-Ming TSAI ,  Chun-chih CHUANG ,  Yung Peng HU

IPC: G03F7/00 ,  G02B26/08

Abstract: Embodiments of the present disclosure generally relate to lithography systems. More particularly, embodiments of the present disclosure relate to a method, a system, and a software application for a lithography process to control transmittance rate of write beams and write gray tone patterns in a single exposure operation. In one embodiment, a plurality of shots are provided by an image projection system in a lithography system to a photoresist layer. The plurality of shots exposes the photoresist layer to an intensity of light emitted from the image projection system. The local transmittance rate of the plurality of shots within an exposure area is varied to form varying step heights in the exposure area of the photoresist layer.

公开(公告)号：US20240134287A1

公开(公告)日：2024-04-25

申请号：US18048748

申请日：2022-10-20

Applicant: Applied Materials, Inc.

Inventor： YingChiao WANG ,  Chi-Ming TSAI ,  Chun-chih CHUANG ,  Yung Peng HU

IPC: G03F7/20 ,  G02B26/08

CPC classification number: G03F7/70191 ,  G02B26/0833

Abstract: Embodiments of the present disclosure generally relate to lithography systems. More particularly, embodiments of the present disclosure relate to a method, a system, and a software application for a lithography process to control transmittance rate of write beams and write gray tone patterns in a single exposure operation. In one embodiment, a plurality of shots are provided by an image projection system in a lithography system to a photoresist layer. The plurality of shots exposes the photoresist layer to an intensity of light emitted from the image projection system. The local transmittance rate of the plurality of shots within an exposure area is varied to form varying step heights in the exposure area of the photoresist layer.