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公开(公告)号:US11886111B2
公开(公告)日:2024-01-30
申请号:US17655583
申请日:2022-03-21
Applicant: Applied Materials, Inc.
Inventor: David Sell , Samarth Bhargava
CPC classification number: G03F7/0005 , G02B25/001
Abstract: Embodiments of the present disclosure generally relate to methods of forming a substrate having a target thickness distribution at one or more eyepiece areas across a substrate. The substrate includes eyepiece areas corresponding to areas where optical device eyepieces are to be formed on the substrate. Each eyepiece area includes a target thickness distribution. A base substrate thickness distribution of a base substrate is measured such that a target thickness change can be determined. The methods described herein are utilized along with the target thickness change to form a substrate with the target thickness distribution.
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公开(公告)号:US11720016B2
公开(公告)日:2023-08-08
申请号:US17315613
申请日:2021-05-10
Applicant: Applied Materials, Inc.
Inventor: David Sell , Samarth Bhargava
CPC classification number: G03F7/0005 , G02B25/001
Abstract: Embodiments of the present disclosure generally relate to methods of forming a substrate having a target thickness distribution at one or more eyepiece areas across a substrate. The substrate includes eyepiece areas corresponding to areas where optical device eyepieces are to be formed on the substrate. Each eyepiece area includes a target thickness distribution. A base substrate thickness distribution of a base substrate is measured such that a target thickness change can be determined. The methods described herein are utilized along with the target thickness change to form a substrate with the target thickness distribution.
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公开(公告)号:US20210382212A1
公开(公告)日:2021-12-09
申请号:US17329955
申请日:2021-05-25
Applicant: Applied Materials, Inc.
Inventor: David Sell , Brian Alexander Cohen
IPC: G02B5/18
Abstract: Embodiments described herein relate to gradient encapsulation of waveguide outcoupler gratings for control of diffraction efficiency and directionality. A device includes a first grating formed over a substrate, the first grating having a plurality of first structures extending away from the substrate, the first grating corresponding to an outcoupler. The device includes a first encapsulant disposed in one or more gaps formed between adjacent first structures, where a fill ratio of the first encapsulant decreases along the first grating. Also described herein are methods for fabricating the device.
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