公开(公告)号：US20220157574A1

公开(公告)日：2022-05-19

申请号：US17455197

申请日：2021-11-16

Applicant: Applied Materials, Inc.

Inventor： Benjamin SCHWARZ ,  Michael D. WILLWERTH ,  Aditi MITHUN ,  Prabhat KUMAR ,  Grace MATHEW ,  Andreas SCHMID

IPC: H01J37/32

Abstract: Embodiments of the present disclosure provide a method and an apparatus for processing a substrate. The apparatus has a ring assembly. The ring assembly has an edge ring and a shadow ring. The edge ring has a ring shaped body. The edge ring body has a top surface and a bottom surface. Pin holes extend through the edge ring body from the top surface to the bottom surface. The shadow ring has a ring shaped body. The shadow ring body has an upper surface and a lower surface. Sockets are formed on the lower surface, wherein the sockets in the shadow ring body align with the pin holes in the edge ring body.