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公开(公告)号：US12225641B2
公开(公告)日：2025-02-11
申请号：US17119377
申请日：2020-12-11
Applicant: Applied Materials, Inc.
Inventor： Hiram Cervera , Yongan Xu , Ludovic Godet
Abstract: Embodiments of the present disclosure relate to bake apparatuses for handling and uniform baking of substrates and methods for the handling and the uniform baking of substrates. The bake apparatuses allow the substrates to be heated to a temperature greater than 50° C. without bowing of about 1 mm to about 2 mm from the edge of the substrates to the center of the substrates. The bake apparatuses heat the substrates uniformly or substantially uniformly to improve substrate quality.
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