公开(公告)号：US20200286717A1

公开(公告)日：2020-09-10

申请号：US16406921

申请日：2019-05-08

Applicant: APPLIED MATERIALS, INC.

Inventor： JAEYONG CHO ,  SHAHID RAUF ,  PENG TIAN

IPC: H01J37/32 ,  H01L21/683

Abstract: Embodiments of an electrostatic chuck are provided herein. In some embodiments, an electrostatic chuck for use in a substrate processing chamber includes a plate having a first side and a second side opposite the first side, a first electrode embedded in the plate proximate the first side, a second electrode embedded in the plate proximate the second side, a plurality of conductive elements coupling the first electrode to the second electrode, a first gas channel disposed within the plate and between the first electrode and the second electrode, a gas inlet extending from the second side of the plate to the first gas channel; and a plurality of gas outlets extending from the first side of the plate to the first gas channel.

公开(公告)号：US20230072594A1

公开(公告)日：2023-03-09

申请号：US17985764

申请日：2022-11-11

Applicant: Applied Materials, Inc.

Inventor： JAEYONG CHO ,  VIJAY D. PARKHE ,  HAITAO WANG ,  KARTIK RAMASWAMY ,  CHUNLEI ZHANG

IPC: H01L21/683 ,  C23C16/458 ,  C23C16/46 ,  C23C16/505 ,  H01J37/32

Abstract: An electrostatic chuck is described that has radio frequency coupling suitable for use in high power plasma environments. In some examples, the chuck includes a base plate, a top plate, a first electrode in the top plate proximate the top surface of the top plate to electrostatically grip a workpiece, and a second electrode in the top plate spaced apart from the first electrode, the first and second electrodes being coupled to a power supply to electrostatically charge the first electrode.