公开(公告)号：US20230154766A1

公开(公告)日：2023-05-18

申请号：US17529684

申请日：2021-11-18

Applicant: Applied Materials, Inc.

Inventor： Songjae LEE ,  Avinash SHERVEGAR ,  Srinivasa RANGAPPA ,  Sundarapandiyan SHANMUGAM ,  Ernesto J. ULLOA ,  Vinodh RAMACHANDRAN ,  Abraham PALATY ,  Jaidev RAJARAM

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67017 ,  H01L21/68707

Abstract: Apparatus for processing a substrate are described herein. More specifically, embodiments described herein relate to separate pre-clean process modules and pre-clean control modules coupled to a cluster tool assembly. Each pre-clean process module and each pre-clean control module are connected by a cable conduit which is configured to have power and control cables passing therethrough between the pre-clean process module and the ore-clean control module. A maintenance passage is formed through the cluster tool assembly. Each of a purge gas source, a process gas source, a manometer, an isolation port, and a throttle valve are all accessible from one side of the pre-clean process module.