公开(公告)号：US20240170317A1

公开(公告)日：2024-05-23

申请号：US17993096

申请日：2022-11-23

Applicant: Applied Materials, Inc.

Inventor： Venkatakaushik VOLETI ,  Keith Buckley WELLS ,  Mehdi VAEZ-IRAVANI

IPC: H01L21/68

CPC classification number: H01L21/681 ,  H01L24/80 ,  H01L2224/8013

Abstract: An apparatus for detecting metrology data in semiconductor packaging processes using fast focus and acquisition techniques to determine alignment metrology data for hybrid bonding. In some embodiments, the apparatus may include a source configured to illuminate a focal point with a wavelength selected from wavelengths greater than 1100 nm, an optical lens that forms an illumination beam when illuminated by the source, an acousto-optic scanner that moves the illumination beam back and forth in a scanning pattern, a splitter to allow the illumination beam to be directed at a metrology sampling location while allowing a reflection beam caused by the illumination beam to pass through the splitter to a detector, a set of optics configured to focus the illumination beam at one or more focal points in a Z direction to obtain subsurface images, and a substrate platform configured to hold a substrate and to move the substrate during scanning.