公开(公告)号：US20250076216A1

公开(公告)日：2025-03-06

申请号：US18799653

申请日：2024-08-09

Applicant: Applied Materials, Inc.

Inventor： Venkatakaushik VOLETI ,  Yun-Ching CHANG ,  Dan XIE ,  Gregory KIRK ,  Mehdi VAEZ-IRAVANI

IPC: G01N21/95 ,  G01N21/47 ,  H01L21/66 ,  H01L23/00

Abstract: An optical inspection system for pre-bonding inspection includes a stage having a surface on which a sample to be inspected is placed, the surface of the sample having at least parts with a two dimensional (2D) periodic pattern which may include defects, an optical head including optics, a dark-field illuminator configured to illuminate the surface of the sample at an first angle, wherein the first angle is an oblique angle, a bright-field illuminator configured to illuminate the surface at a second angle, a dark-field collection path, a bright-field collection path, and a sensor configured to detect light transmitted from the dark-field illuminator, scattered at the surface of the sample, collected by the optical head, and relayed through the dark-field collection path, and light transmitted from the bright-field illuminator, reflected at the surface of the sample, and relayed through the bright-field collection path.

公开(公告)号：US20240170317A1

公开(公告)日：2024-05-23

申请号：US17993096

申请日：2022-11-23

Applicant: Applied Materials, Inc.

Inventor： Venkatakaushik VOLETI ,  Keith Buckley WELLS ,  Mehdi VAEZ-IRAVANI

IPC: H01L21/68

CPC classification number: H01L21/681 ,  H01L24/80 ,  H01L2224/8013

Abstract: An apparatus for detecting metrology data in semiconductor packaging processes using fast focus and acquisition techniques to determine alignment metrology data for hybrid bonding. In some embodiments, the apparatus may include a source configured to illuminate a focal point with a wavelength selected from wavelengths greater than 1100 nm, an optical lens that forms an illumination beam when illuminated by the source, an acousto-optic scanner that moves the illumination beam back and forth in a scanning pattern, a splitter to allow the illumination beam to be directed at a metrology sampling location while allowing a reflection beam caused by the illumination beam to pass through the splitter to a detector, a set of optics configured to focus the illumination beam at one or more focal points in a Z direction to obtain subsurface images, and a substrate platform configured to hold a substrate and to move the substrate during scanning.

公开(公告)号：US20250076212A1

公开(公告)日：2025-03-06

申请号：US18798303

申请日：2024-08-08

Applicant: Applied Materials, Inc.

Inventor： Venkatakaushik VOLETI ,  Mehdi VAEZ-IRAVANI

IPC: G01N21/88 ,  G01N21/95 ,  H01L21/66

Abstract: An optical inspection system for pre-bonding inspection system includes a stage on which a sample to be inspected is placed, a sensor, optical assemblies, each including an optical head having optics to direct a sample field-of-view (FOV) to a portion of the sample, a first light source configured to illuminate the sample at a first oblique angle, a second light source configured to illuminate the sample at a second oblique angle, a focusing lens to focus a first optical image of the portion of the sample generated by the first light source, and a second optical image of the portion of the sample generated by the second light source onto a segment of the sensor, and a controller configured to combine the first optical image and the second optical image generated by each optical assembly, and generate a map of point defects on the sample.

公开(公告)号：US20240363446A1

公开(公告)日：2024-10-31

申请号：US18141306

申请日：2023-04-28

Applicant: Applied Materials, Inc.

Inventor： Venkatakaushik VOLETI ,  Kyle TANTIWONG ,  Mehdi VAEZ-IRAVANI

IPC: H01L21/66 ,  H01L21/67 ,  H01L23/00

CPC classification number: H01L22/12 ,  H01L21/67144 ,  H01L21/67288 ,  H01L24/80 ,  H01L2224/8001 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/80908

Abstract: Methods and apparatus of hybrid bonding with inspection are provided herein. In some embodiments, a method of hybrid bonding with inspection includes: cleaning a substrate via a first cleaning chamber and a tape frame having a plurality of chiplets via a second cleaning chamber; inspecting, via a first metrology system, the substrate for pre-bond defects in a first metrology chamber and the tape frame for pre-bond defects in a second metrology chamber; bonding one or more of the plurality of chiplets to the substrate via a hybrid bonding process in a bonder chamber to form a bonded substrate; and performing, via a second metrology system different than the first metrology system, a post-bond inspection of the bonded substrate via a third metrology chamber for post-bond defects.

公开(公告)号：US20240241456A1

公开(公告)日：2024-07-18

申请号：US18098482

申请日：2023-01-18

Applicant: Applied Materials, Inc.

Inventor： Venkatakaushik VOLETI ,  Mehdi VAEZ-IRAVANI

IPC: G03F9/00 ,  G03F7/20

CPC classification number: G03F9/7088 ,  G03F7/70775 ,  G03F9/7069

Abstract: Methods and apparatus for detecting metrology data are provided herein. For example, an apparatus comprises a substrate support configured to support a substrate and another substrate disposed on the substrate, an incoherent light source configured to transmit an illumination beam through the substrate and the another substrate, a set of optics configured to direct the illumination beam when transmitted through the substrate and the another substrate, an actuator operably coupled to the substrate support and configured to move the substrate and another substrate back and forth in a scanning pattern, and a sensor operably coupled to the actuator, synchronized therewith, and configured to receive the illumination beam from the set of optics to obtain subsurface images of the substrate and the another substrate.

公开(公告)号：US20250123569A1

公开(公告)日：2025-04-17

申请号：US18485147

申请日：2023-10-11

Applicant: Applied Materials, Inc.

Inventor： Yau Loong CHONG ,  Venkatakaushik VOLETI ,  Ruiping WANG ,  Mehdi VAEZ-IRAVANI

IPC: G03F7/00 ,  G06T7/00

Abstract: Embodiments of the disclosure include a method for forming a device comprising generating an image of a second die that is bonded on a first die that is bonded on a base substrate, the first die having a first feature formed on a first surface of the first die and the second die having a second feature formed on a second surface of the second die, determining a relative displacement between portions of the first feature and the second feature based on the generated image, and determining updated alignment instructions based on the determined relative displacement

公开(公告)号：US20250062145A1

公开(公告)日：2025-02-20

申请号：US18234591

申请日：2023-08-16

Applicant: Applied Materials, Inc.

Inventor： Venkatakaushik VOLETI ,  Mehdi VAEZ-IRAVANI

IPC: H01L21/67 ,  G06T7/00 ,  G06T7/73

Abstract: A scanning inspection apparatus detects anomalies on surfaces of objects such as substrates, substrates with bonded chiplets, and carriers with singulated chiplets and the like. In some embodiments, the inspection apparatus includes a time delay integrated (TDI) linear sensor with an optical input and a data output where more than one optical assembly is positioned adjacent to each other with an optical output focused on a different segment of the TDI linear sensor and with an optical input positioned to receive a portion of a surface under examination. The apparatus may further include a platform with an upper surface for supporting an object with the surface under examination and with a motion assembly to move the platform and with a controller in communication with the motion assembly to move the platform in relation to the optical input of the optical assembly.