公开(公告)号：USD970566S1

公开(公告)日：2022-11-22

申请号：US29813065

申请日：2021-10-26

Applicant: APPLIED MATERIALS, INC.

Designer： Martin Riker ,  William Fruchterman ,  Ilya Lavitsky ,  Srinivasa Rao Yedla ,  Kirankumar Neelasandra Savandaiah

公开(公告)号：US11692262B2

公开(公告)日：2023-07-04

申请号：US16930794

申请日：2020-07-16

Applicant: Applied Materials, Inc.

Inventor： Alexander Jansen ,  Keith A. Miller ,  Prashanth Kothnur ,  Martin Riker ,  David Gunther ,  Emily Schooley

IPC: C23C14/35 ,  C23C14/34

CPC classification number: C23C14/354 ,  C23C14/3407 ,  C23C14/3471

Abstract: Apparatus and methods for controlling plasma profiles during PVD deposition processes are disclosed. Some embodiments utilize EM coils placed above the target to control the plasma profile during deposition.

公开(公告)号：US20220341029A1

公开(公告)日：2022-10-27

申请号：US17861969

申请日：2022-07-11

Applicant: Applied Materials, Inc.

Inventor： Alexander Jansen ,  Keith A. Miller ,  Prashanth Kothnur ,  Martin Riker ,  David Gunther ,  Emily Schooley

IPC: C23C14/35 ,  C23C14/34

Abstract: Apparatus and methods for controlling plasma profiles during PVD deposition processes are disclosed. Some embodiments utilize EM coils placed above the target to control the plasma profile during deposition.

公开(公告)号：USD937329S1

公开(公告)日：2021-11-30

申请号：US29728957

申请日：2020-03-23

Applicant: APPLIED MATERIALS, INC.

Designer： Martin Riker ,  William Fruchterman ,  Ilya Lavitsky ,  Srinivasa Rao Yedla ,  Kirankumar Neelasandra Savandaiah

公开(公告)号：US20210017639A1

公开(公告)日：2021-01-21

申请号：US16930794

申请日：2020-07-16

Applicant: Applied Materials, Inc.

Inventor： Alexander Jansen ,  Keith A. Miller ,  Prashanth Kothnur ,  Martin Riker ,  David Gunther ,  Emily Schooley

IPC: C23C14/35 ,  C23C14/34

Abstract: Apparatus and methods for controlling plasma profiles during PVD deposition processes are disclosed. Some embodiments utilize EM coils placed above the target to control the plasma profile during deposition.