公开(公告)号：US20220016739A1

公开(公告)日：2022-01-20

申请号：US17365848

申请日：2021-07-01

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon OH ,  Ashish BHUSHAN ,  Jamie Stuart LEIGHTON ,  John Anthony GARCIA ,  Stephen Thomas CORMIER ,  Nick Joseph JACKSON ,  Manoj BALAKUMAR ,  Nandkishore PATIDAR

IPC: B24B37/015

Abstract: Embodiments of the present disclosure generally relate to chemical mechanical polishing systems (CMP) systems and processes used in the manufacturing of electronic devices. In particular, embodiments herein relate to methods of detecting non-conforming substrate processing events during a polishing process. In one embodiment, a method of processing a substrate on a polishing system includes urging a surface of a silicon carbide substrate against a polishing pad in the presence of a polishing fluid, determining a temperature of the polishing pad using a temperature sensor that is positioned above the platen, monitoring the temperature of the polishing pad, and, if the change in polishing pad temperature reaches a threshold value, initiating a response using a controller of the polishing system.