公开(公告)号：US20230088457A1

公开(公告)日：2023-03-23

申请号：US17863145

申请日：2022-07-12

Applicant: Applied Materials, Inc.

Inventor： Lakshmikanth Krishnamurthy SHIRAHATTI ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Pallab KARMAKAR

IPC: C23C14/54 ,  C23C14/24

Abstract: A substrate processing system that includes a multi-station processing chamber that includes a plurality of process stations is provided. Each process station has one or more processing components cooled by a cooling system. In one embodiment, the cooling system includes a closed loop monitoring system comprising a flow control valve fluidly coupled to a coolant supply line, a valve position measuring system for continuously monitoring the position of the valve, and a valve position controller for adjusting the position of the valve.