公开(公告)号：US20240429089A1

公开(公告)日：2024-12-26

申请号：US18212672

申请日：2023-06-21

Applicant: Applied Materials, Inc.

Inventor： Peter MURAOKA ,  Sumanth BANDA ,  Andreas SCHMID ,  Sunil SRINIVASAN ,  Paul Z. WIRTH

IPC: H01L21/687 ,  G05B15/02 ,  H01J37/32 ,  H01L21/3065

Abstract: Embodiments described herein generally related to a substrate processing chamber and a method of processing substrate in a processing chamber. In one embodiment, a method of using a process kit for a substrate processing chamber disclosed herein. The method begins by positioning the substrate on a substrate support disposed in the substrate processing chamber. A plasma is formed above the substrate and a tilt and height of an edge ring is adjusted with a controller. The controller is coupled to a movement assembly having one of three linear actuators for tilting a sliding ring interfaced with the edge ring to change a direction of ions at one edge of the substrate.