公开(公告)号：US20200373184A1

公开(公告)日：2020-11-26

申请号：US16857082

申请日：2020-04-23

Applicant: Applied Materials, Inc.

Inventor： Stephen Donald PROUTY ,  Andreas SCHMID ,  Jonathan SIMMONS ,  Sumanth BANDA

IPC: H01L21/683 ,  H01L21/673

Abstract: A substrate support pedestal comprises an electrostatic chuck, a cooling base, a gas flow passage, a porous plug, and a sealing member. The electrostatic chuck comprises body having a cavity. The cooling base is coupled to the electrostatic chuck via a bond layer. The gas flow passage is formed between a top surface of the electrostatic chuck and a bottom surface of the cooling base. The gas flow passage further comprises the cavity. The porous plug is positioned within the cavity to control the flow of gas through the gas flow passage. The sealing member is positioned adjacent to the porous plug and is configured to form one or more of a radial seal between the porous plug and the cavity and an axial seal between the porous plug and the cooling base.

公开(公告)号：US20240429089A1

公开(公告)日：2024-12-26

申请号：US18212672

申请日：2023-06-21

Applicant: Applied Materials, Inc.

Inventor： Peter MURAOKA ,  Sumanth BANDA ,  Andreas SCHMID ,  Sunil SRINIVASAN ,  Paul Z. WIRTH

IPC: H01L21/687 ,  G05B15/02 ,  H01J37/32 ,  H01L21/3065

Abstract: Embodiments described herein generally related to a substrate processing chamber and a method of processing substrate in a processing chamber. In one embodiment, a method of using a process kit for a substrate processing chamber disclosed herein. The method begins by positioning the substrate on a substrate support disposed in the substrate processing chamber. A plasma is formed above the substrate and a tilt and height of an edge ring is adjusted with a controller. The controller is coupled to a movement assembly having one of three linear actuators for tilting a sliding ring interfaced with the edge ring to change a direction of ions at one edge of the substrate.

公开(公告)号：US20190304827A1

公开(公告)日：2019-10-03

申请号：US15943285

申请日：2018-04-02

Applicant: Applied Materials, Inc.

Inventor： Wendell Glenn BOYD, JR. ,  Sumanth BANDA

IPC: H01L21/683 ,  C04B37/02

Abstract: A method and structure for a bonding layer are disclosed. The bonding structure includes a first portion surrounding an opening in a body defining a dam thereabout. A second portion surrounds the first portion. The first portion is formed from a material resistant to degradation from exposure to a process gas. The second portion is formed from a different material than the material of the first portion. The first portion further includes one or more additives to change properties thereof.

公开(公告)号：US20150061237A1

公开(公告)日：2015-03-05

申请号：US14534574

申请日：2014-11-06

Applicant: APPLIED MATERIALS, INC.

Inventor： Jennifer SUN ,  Sumanth BANDA ,  Ren-Guan DUAN

IPC: B23B31/28 ,  B23Q3/00 ,  B05B1/14

CPC classification number: B23B31/28 ,  B05B1/14 ,  B23B31/02 ,  B23Q3/00 ,  B32B15/08 ,  C04B35/6269 ,  C04B35/63424 ,  C04B37/005 ,  C04B37/006 ,  C04B37/008 ,  C04B37/025 ,  C04B37/026 ,  C04B37/028 ,  C04B2235/604 ,  C04B2237/064 ,  C04B2237/08 ,  C04B2237/12 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/402 ,  C04B2237/55 ,  C04B2237/62 ,  H01L21/6831 ,  Y10T156/10 ,  Y10T279/23

Abstract: Embodiments of the present disclosure generally provide chamber components with enhanced thermal properties and methods of enhancing thermal properties of chamber components including bonding materials. One embodiment of the present disclosure provides a method for fabricating a composite structure. The method includes applying a bonding material to a first component, and converting the bonding material applied to the first component to an enhanced bonding layer by heating the bonding material to outgas volatile species from the bonding material. The outgassed volatile species accumulates to at least 0.05% in mass of the bonding material. The method further includes contacting a second component and the enhanced bonding layer to join the first and second components.

Abstract translation: 本公开的实施例通常提供具有增强的热性质的腔室部件和增强包括接合材料的腔室部件的热性能的方法。 本公开的一个实施例提供了一种用于制造复合结构的方法。 该方法包括：向第一部件施加接合材料，并且通过加热接合材料将从第一部件施加的接合材料转化为增强的接合层，从而从接合材料排出挥发性物质。 脱气的挥发性物质在接合材料的质量上累积至少0.05％。 该方法还包括使第二组分和增强的结合层接触以连接第一和第二组分。

公开(公告)号：US20220172975A1

公开(公告)日：2022-06-02

申请号：US17672507

申请日：2022-02-15

Applicant: Applied Materials, Inc.

Inventor： Stephen Donald PROUTY ,  Andreas SCHMID ,  Jonathan SIMMONS ,  Sumanth BANDA

IPC: H01L21/683 ,  H01L21/673

Abstract: A substrate support pedestal comprises an electrostatic chuck, a cooling base, a gas flow passage, a porous plug, and a sealing member. The electrostatic chuck comprises body having a cavity. The cooling base is coupled to the electrostatic chuck via a bond layer. The gas flow passage is formed between a top surface of the electrostatic chuck and a bottom surface of the cooling base. The gas flow passage further comprises the cavity. The porous plug is positioned within the cavity to control the flow of gas through the gas flow passage. The sealing member is positioned in a groove formed in the cooling base and configured to form a seal between the cooling base and one or both of the porous plug and the body of the electrostatic chuck.

公开(公告)号：US20150183187A1

公开(公告)日：2015-07-02

申请号：US14657875

申请日：2015-03-13

Applicant: Applied Materials, Inc.

Inventor： Xing LIN ,  Jennifer Y. SUN ,  Sumanth BANDA

IPC: B32B7/12 ,  B32B3/04 ,  B32B3/08

CPC classification number: B32B7/12 ,  B32B3/04 ,  B32B3/08 ,  H01L21/6833 ,  Y10T428/23 ,  Y10T428/239 ,  Y10T428/31504

Abstract: Embodiments of the present invention provide chamber components having a protective element for shielding bonding material from processing environments in a processing environment. The protective element may include protective seals, protective structures, erosion resistive filers, or combinations thereof. Embodiments of the present invention reduce erosion of bonding material used in a processing chamber, thus, improving processing quality and reducing maintenance costs.

Abstract translation: 本发明的实施例提供了具有用于在处理环境中将结合材料从处理环境中遮蔽的保护元件的腔室部件。 保护元件可以包括保护性密封件，保护结构，冲蚀阻性封装件或其组合。 本发明的实施例减少了处理室中使用的接合材料的侵蚀，从而提高了加工质量并降低了维护成本。

公开(公告)号：US20240404835A1

公开(公告)日：2024-12-05

申请号：US18804929

申请日：2024-08-14

Applicant: Applied Materials, Inc.

Inventor： Leonard M. TEDESCHI ,  Kartik RAMASWAMY ,  Benjamin CE SCHWARZ ,  Changgong WANG ,  Vahid FIROUZDOR ,  Sumanth BANDA ,  Teng-Fang KUO

IPC: H01L21/3065 ,  H01J37/32 ,  H01L21/02 ,  H01L21/311 ,  H01L21/683

Abstract: Methods of semiconductor processing may include forming a plasma of a carbon-containing material within a processing region of a semiconductor processing chamber. The methods may include depositing a carbon-containing material on a backside of a substrate housed within the processing region of the semiconductor processing chamber. A front side of the substrate may be maintained substantially free of carbon-containing material. The methods may include performing an etch process on the front-side of the substrate. The methods may include removing the carbon-containing material from the backside of the substrate.

公开(公告)号：US20200238303A1

公开(公告)日：2020-07-30

申请号：US16846000

申请日：2020-04-10

Applicant: APPLIED MATERIALS, INC.

Inventor： Dmitry LUBOMIRSKY ,  Vladimir KNYAZIK ,  Hamid NOORBAKHSH ,  Jason DELLA ROSA ,  Zheng John YE ,  Jennifer Y. SUN ,  Sumanth BANDA

IPC: B05B1/00 ,  H01J37/32 ,  B05B1/18 ,  C23C16/455

Abstract: Embodiments of showerheads having a detachable gas distribution plate are provided herein. In some embodiments, a showerhead for use in a substrate processing chamber includes a body having a first side and an opposing second side; a gas distribution plate disposed proximate the second side of the body; and a clamp disposed about a peripheral edge of the gas distribution plate to removably couple the gas distribution plate to the body, wherein the body is electrically coupled to the gas distribution plate through the clamp.

公开(公告)号：US20160002811A1

公开(公告)日：2016-01-07

申请号：US14762151

申请日：2014-03-03

Applicant: APPLIED MATERIALS, INC.

Inventor： Jennifer Y. SUN ,  Sumanth BANDA

IPC: C25D11/04 ,  C25D3/54 ,  C25D5/48

CPC classification number: C25D11/04 ,  C25D3/54 ,  C25D5/48 ,  C25D11/024 ,  C25D17/001

Abstract: To manufacture a chamber component for a processing chamber, an aluminum coating is formed on an article comprising impurities, the aluminum coating being substantially free from impurities.

Abstract translation: 为了制造用于处理室的室部件，在包含杂质的制品上形成铝涂层，铝涂层基本上不含杂质。