公开(公告)号：US20240379411A1

公开(公告)日：2024-11-14

申请号：US18315972

申请日：2023-05-11

Applicant: Applied Materials, Inc.

Inventor： Peng SOU ,  Chang Bum YONG ,  Guan Huei SEE ,  Arvind SUNDARRAJAN

IPC: H01L21/768 ,  G03F7/20 ,  G03F7/30

Abstract: Apparatus and methods for fabricating an electronic device are provided herein. Some embodiments include selectively delivering, according to a digital transfer pattern, an electromagnetic radiation beam provided from a light source across portions of an electromagnetic radiation sensitive layer that comprises a first photosensitive layer disposed on a surface of a substrate and a second photosensitive layer disposed on the first photosensitive layer. The electromagnetic beam may be delivered at a plurality of different dosing levels. The first and second photosensitive layers have first and second exposure sensitivities. Some embodiments also include performing, after selectively delivering the electromagnetic radiation beam, a developing and/or curing process on the first and second photosensitive layers to form a first and second set of features, respectively, which are to be filled with a conductor during a deposition process.