公开(公告)号：US20240387224A1

公开(公告)日：2024-11-21

申请号：US18198003

申请日：2023-05-16

Applicant: Applied Materials, Inc.

Inventor： Yogananda Sarode ,  Anand Kumar ,  Prashant V. Javali

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/687

Abstract: A device includes a hybrid puck corresponding to an electrostatic chuck. The hybrid puck includes a backing region and a chucking region disposed on the backing region. The backing region includes a first dielectric material to improve thermal performance of the hybrid puck. The chucking region includes a second dielectric material different from the first dielectric material to improve leakage current stability.