-
公开(公告)号:US20170363960A1
公开(公告)日:2017-12-21
申请号:US15692087
申请日:2017-08-31
Applicant: Applied Materials, Inc.
Inventor: Viachslav BABAYAN , Douglas A. BUCHBERGER, Jr. , Qiwei LIANG , Ludovic GODET , Srinivas D. NEMANI , Daniel J. WOODRUFF , Randy HARRIS , Robert B. MOORE
IPC: G03F7/20 , H01L21/687
Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.
-
公开(公告)号:US20220004104A1
公开(公告)日:2022-01-06
申请号:US17468536
申请日:2021-09-07
Applicant: Applied Materials, Inc.
Inventor: Viachslav BABAYAN , Douglas A. BUCHBERGER, JR. , Qiwei LIANG , Ludovic GODET , Srinivas D. NEMANI , Daniel J. WOODRUFF , Randy HARRIS , Robert B. MOORE
Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.
-
公开(公告)号:US20190187563A1
公开(公告)日:2019-06-20
申请号:US16272962
申请日:2019-02-11
Applicant: Applied Materials, Inc.
Inventor: Viachslav BABAYAN , Douglas A. BUCHBERGER, JR. , Qiwei LIANG , Ludovic GODET , Srinivas D. NEMANI , Daniel J. WOODRUFF , Randy HARRIS , Robert B. MOORE
IPC: G03F7/20 , G03F7/38 , H01L21/687 , G03F7/16 , G03F7/26
CPC classification number: G03F7/2035 , G03F7/168 , G03F7/26 , G03F7/38 , H01L21/68764
Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.
-
-