公开(公告)号：US20250014878A1

公开(公告)日：2025-01-09

申请号：US18218579

申请日：2023-07-05

Applicant: Applied Materials, Inc.

Inventor： Andreas SCHMID ,  Sahiti NALLAGONDA ,  Peter MURAOKA ,  Michael T. NICHOLS ,  Denis Martin KOOSAU ,  Stephen D. PROUTY ,  Sunil SRINIVASAN ,  Pranav BADOLE

IPC: H01J37/34

Abstract: Embodiments described herein generally related to a substrate processing apparatus. In one embodiment, a process kit for a substrate processing chamber disclosed herein. The process kit includes a ring having a first ring component and a second ring component, a sliding ring, and an actuating mechanism. The first ring component is interfaced with the second ring component such that the second ring component is movable relative to the first ring component forming a gap therebetween. The sliding ring is positioned beneath the ring and contacts a bottom surface of the second ring component. A top surface of the sliding ring contacts the second ring component. The actuating mechanism is interfaced with the bottom surface of the sliding ring. The actuating mechanism is configured to actuate the sliding ring such that the gap between the first ring component and the second ring component varies.

公开(公告)号：US20250075795A1

公开(公告)日：2025-03-06

申请号：US18523111

申请日：2023-11-29

Applicant: Applied Materials, Inc.

Inventor： Jonathan SIMMONS ,  Andreas SCHMID ,  Sahiti NALLAGONDA

IPC: F16J15/06 ,  H01J37/32

Abstract: Disclosed herein is a seal assembly for a substrate processing chamber and a component assembly containing the seal assembly. The seal assembly includes a ring-shaped seal member; a holder disposed radially inward of the ring-shaped seal member; and a retaining mechanism coupling the ring-shaped seal member with the holder. The component assembly includes a first component coupled with a second component via a bonding layer; a groove formed by the first component, the second component, and the bonding layer; and the seal assembly disposed in the groove.